H5TQ4G63CFR-RDI

Compact PBGA package ideal for space-constrained design
7,048 有效庫存

H5TQ4G63CFR-RDI

有效庫存7,048

Compact PBGA package ideal for space-constrained design

  • 製造商零件號 # : H5TQ4G63CFR-RDI

  • 製造商: Sk Hynix Inc

  • 產品分類 : Controllers

品質保證

品質保證

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運輸與付款

運輸與付款

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關於付款

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如果您有特定的付款方式或想詢問費率和其他詳細信息，請隨時與我們聯繫。

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電匯

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Paypal

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信用卡

western

西聯匯款

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速匯金

服務與包裝

服務與包裝

About After Sales Service

All Parts Extended Quality Guarantee

自發貨之日起 90 天內發起申請。

與我們的工作人員確認退貨或換貨。

保持貨物收到時的原始狀態。

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關於包裝

在包裝方面，我們的產品均精心包裝在防靜電袋中，以提供ESD防靜電保護。 外包裝堅固耐用且閉合牢固。 我們支持各種包裝方法，例如捲帶式、切帶式、管式或託盤式。

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例子

捲帶式

捲帶式

剪膠帶

剪膠帶

管或託盤

管或託盤

H5TQ4G63CFR-RDI 數據表
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目前的價格方案正在編制中。請聯絡我們的客戶服務團隊獲取最新的價格資訊。感謝您的理解和支援!

快速報價

請提交詢價 H5TQ4G63CFR-RDI 或發送電子郵件給我們： Email: [email protected], 我們將在 12 小時內與您聯繫。

詳細說明

Introduction to H5TQ4G63CFR-RDI

The H5TQ4G63CFR-RDI is a high-speed synchronous dynamic random-access memory (SDRAM) IC manufactured by SK Hynix. This IC is designed to provide high-density and high-speed memory for various electronic devices, including smartphones, tablets, and other computing systems. With its high data transfer rates and low power consumption, the H5TQ4G63CFR-RDI is ideal for applications requiring fast and reliable memory performance.

Specs and Features

  • Memory Type: Synchronous dynamic random-access memory (SDRAM) offering high-speed data access.
  • Density: High-density configuration for storing large amounts of data in a compact form factor.
  • Data Transfer Rate: Supports high-speed data transfer for improved system performance and responsiveness.
  • Low Power Consumption: Designed for energy-efficient operation, contributing to overall system power efficiency.
  • Operating Voltage: Compatible with standard voltage levels for seamless integration into various electronic platforms.
  • Package Type: Available in industry-standard packages for easy PCB assembly and compatibility.

Application and Uses

The H5TQ4G63CFR-RDI is well-suited for applications requiring high-speed and high-density memory:

  • Mobile Devices: Used in smartphones, tablets, and handheld devices for multi-tasking and high-performance data processing.
  • Computer Systems: Integrated into desktops, laptops, and servers for fast data storage and system operation.
  • Networking Equipment: Applied in routers, switches, and network appliances for high-speed data buffering and packet processing.
  • Embedded Systems: Utilized in industrial control systems, IoT devices, and automotive electronics for reliable data storage and processing.

Equivalent Part

For similar functionalities, consider these alternatives to the H5TQ4G63CFR-RDI:

  • MT47H64M16HR-25E: High-speed SDRAM IC with similar performance and features for computing and networking applications.
  • NT5CC256M16DP-DI: High-density SDRAM IC offering low power consumption and fast data transfer for mobile and embedded systems.

規格

以下是所選零件的基本參數，涉及零件的特性及其所屬類別。

Rohs Code Yes Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC Package Description TFBGA,
Reach Compliance Code compliant ECCN Code EAR99
HTS Code ! 8542.32.00.36 Access Mode ! MULTI BANK PAGE BURST
Additional Feature ! AUTO/SELF REFRESH JESD-30 Code R-PBGA-B96
Length 13 mm Memory Density 4294967296 bit
Memory IC Type DDR DRAM Memory Width 16
Number of Functions 1 Number of Ports ! 1
Number of Terminals 96 Number of Words 268435456 words
Number of Words Code 256000000 Operating Mode ! SYNCHRONOUS
Operating Temperature-Max 85 °C Operating Temperature-Min -40 °C
Organization 256MX16 Package Body Material PLASTIC/EPOXY
Package Code TFBGA Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.2 mm Self Refresh YES
Supply Voltage-Max (Vsup) 1.575 V Supply Voltage-Min (Vsup) 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V Surface Mount ! YES
Technology CMOS Temperature Grade ! INDUSTRIAL
Terminal Form ! BALL Terminal Pitch ! 0.8 mm
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm

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