H5TC4G63AFR-PBA

Name: H5TC4G63AFR-PBA
Rating: 4.5 (10 reviews)

256MX16, 0.225ns, CMOS

3,061 有效庫存

H5TC4G63AFR-PBA

有效庫存3,061

256MX16, 0.225ns, CMOS

製造商零件號 # : H5TC4G63AFR-PBA
包裝/封裝: FBGA96
製造商: SKHYNIX
產品分類 : Memory

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服務與包裝

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關於包裝

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例子

捲帶式

剪膠帶

管或託盤

H5TC4G63AFR-PBA 數據表

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詳細說明

The H5TC4G63AFR-PBA is a DDR4 SDRAM module produced by SK Hynix. It has a capacity of 4 gigabytes and operates at a speed of 2400MHz. The module is designed to be used in desktop and laptop computers, as well as other electronic devices that require high-performance memory.The H5TC4G63AFR-PBA uses a 1.2V power supply and features a 96-ball FBGA package. It has a CAS latency of 17 and a clock cycle time of 0.833ns. The module is organized into 8 banks and offers a burst length of 8.In terms of performance, the H5TC4G63AFR-PBA has a maximum data rate of 19.2GB/s and supports data transfer rates of up to 4800Mbps/pin. It also features on-die termination (ODT) and a self-refresh mode to help conserve power when the memory is not in use.

主要特徵

4Gb capacity
400MHz operating frequency
Low power consumption
3.3V power supply
Programmable CAS latency
RoHS compliant
Serial presence detect
Supports auto pre-charge power down mode
64ms refresh interval
Temperature sensor

應用

Smartphones
Tablets
Laptops
Digital cameras
Automotive infotainment systems
Virtual reality headsets
Networking equipment
Industrial automation
Medical devices
Gaming consoles

規格

以下是所選零件的基本參數，涉及零件的特性及其所屬類別。

Rohs Code	Yes	Part Life Cycle Code	Obsolete
Part Package Code	BGA	Pin Count !	96
Reach Compliance Code		ECCN Code	EAR99
HTS Code !	8542.32.00.36	Access Mode !	MULTI BANK PAGE BURST
Access Time-Max	0.225 ns	Additional Feature !	AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)	800 MHz	I/O Type	COMMON
Interleaved Burst Length	4,8	JESD-30 Code	R-PBGA-B96
Length	13 mm	Memory Density	4294967296 bit
Memory IC Type	DDR3L DRAM	Memory Width	16
Number of Functions	1	Number of Ports !	1
Number of Terminals	96	Number of Words	268435456 words
Number of Words Code	256000000	Operating Mode !	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min
Organization	256MX16	Output Characteristics	3-STATE
Package Body Material	PLASTIC/EPOXY	Package Code	TFBGA
Package Equivalence Code	BGA96,9X16,32	Package Shape	RECTANGULAR
Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH	Peak Reflow Temperature (Cel)	NOT SPECIFIED
Power Supplies !	1.35 V	Qualification Status !	Not Qualified
Refresh Cycles	8192	Seated Height-Max	1.2 mm
Self Refresh	YES	Sequential Burst Length	4,8
Standby Current-Max	0.012 A	Supply Current-Max	0.2 mA
Supply Voltage-Max (Vsup)	1.45 V	Supply Voltage-Min (Vsup)	1.283 V
Supply Voltage-Nom (Vsup)	1.35 V	Surface Mount !	YES
Technology	CMOS	Temperature Grade !	OTHER
Terminal Form !	BALL	Terminal Pitch !	0.8 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Width	9 mm

Specification Comparison

H5TC4G63EFR-RDI vs H5TC4G63AFR-PBA vs H5TC4G63CFR-RDA H5TC4G63EFR-PBA vs H5TC4G63AFR-PBA vs H5TC4G63CFR-RDA

數據表 PDF

數據表記錄了器件的特性、絕對最大額定值、應用等，這對於作為器件特定應用的整體指南大有裨益。

初步規格 H5TC4G63AFR-PBA PDF 下載

常見問題解答

What is H5TC4G63AFR-PBA?

The H5TC4G63AFR-PBA is a DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) module designed by SK Hynix. It is commonly used in computer systems, servers, and high-performance computing applications to provide high-speed data storage and access.

How Does H5TC4G63AFR-PBA Work?

The H5TC4G63AFR-PBA works by storing data in an array of capacitors that represent individual memory cells. It utilizes a synchronous interface to transfer data on both the rising and falling edges of the clock signal, effectively doubling the data transfer rate compared to earlier DDR standards. This allows for high-speed data access and efficient operation in modern computing systems.

How Many Pins does H5TC4G63AFR-PBA have and What are the Functions of the Pinout Configuration?

The H5TC4G63AFR-PBA is typically available in a 96-ball BGA (Ball Grid Array) package. The pinout configuration includes:

Data & Address Pins: These pins are used to transfer data and memory addresses between the SDRAM and the memory controller.
Power and Ground Pins: These pins provide the necessary power supply and grounding for the SDRAM module.
Clock and Control Pins: These pins include the clock signal and various control signals to synchronize data transfer and operations.
DM Pins: Data Mask pins used for write data masking during write operations.
Other Control Pins: Pins for functions such as reset, interrupt, and other control signals.

What are the Pros and Cons of H5TC4G63AFR-PBA?

Pros:

High Speed: Provides high-speed data transfer, enhancing system performance.
High Capacity: Offers large memory capacity for storing and accessing a significant amount of data.
Reliability: Synchronous interface and advanced memory management features contribute to reliable operation.
Compatibility: Designed to be compatible with modern computing platforms and memory controllers.
Efficiency: DDR4 technology provides improved power efficiency compared to earlier DDR standards.

Cons:

Cost: DDR4 memory modules may have a higher cost compared to older DDR standards.
Complexity: Proper system design and memory controller configuration are required for optimal performance.
Signal Integrity: BGA packages and high-speed operation require careful consideration of signal integrity and PCB layout.

Are There Any Equivalents/Alternatives to H5TC4G63AFR-PBA for Recommendation?

The MT40A2G8 from Micron Technology is a similar DDR4 SDRAM module with comparable specifications.
Alternatives to the H5TC4G63AFR-PBA include the K4A8G085WB-BCRC from Samsung and the NT5CC256M16DP-DI from Nanya Technology.