H5AN8G8NCJR-VKC

Enhance your computing experience with this reliable and compatible memory solutio
5,074 有效庫存

H5AN8G8NCJR-VKC

有效庫存5,074

Enhance your computing experience with this reliable and compatible memory solutio

  • 製造商零件號 # : H5AN8G8NCJR-VKC

  • 包裝/封裝: FBGA-78

  • 製造商: Sk Hynix

  • 產品分類 : Controllers

品質保證

品質保證

從我們的供應鍊網路採購的所有零件都經過嚴格的進貨檢驗流程。 這種細緻的檢查可確保客戶收到的零件是正品並符合要求的標準。 此外，我們還保存這些檢查的詳細記錄，以確保整個供應鏈的透明度和可追溯性。

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認證

我們已成功獲得各項認證標準，並建立了自己的專業檢測實驗室。 這確保了我們向客戶提供的每件產品都符合最高的品質標準。 我們遵守嚴格的測試協議，以保持我們產品的一致性和準確性。 為了確保我們的產品是原裝正品，我們還與信譽良好的第三方檢測機構合作進行嚴格的品質測試。 我們對品質的承諾延伸到滿足行業、法律、監管和 ISO 9001:2015 的要求。

運輸與付款

運輸與付款

關於運送

我們通常會在幾個工作日內通過可靠的運輸公司（例如 FedEx、SF、UPS 或 DHL）運送訂單。 我們還支持其他運輸方式。 如果您想詢問具體的運輸細節或費用，請隨時與我們聯繫。

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關於付款

我們接受多種支付方式，包括VISA、MasterCard、銀聯、西聯、PayPal等渠道。

如果您有特定的付款方式或想詢問費率和其他詳細信息，請隨時與我們聯繫。

wire

電匯

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Paypal

cc

信用卡

western

西聯匯款

mg

速匯金

服務與包裝

服務與包裝

About After Sales Service

All Parts Extended Quality Guarantee

自發貨之日起 90 天內發起申請。

與我們的工作人員確認退貨或換貨。

保持貨物收到時的原始狀態。

最後請注意，退貨或換貨的資格取決於對退貨商品實際狀況的評估。 在完成退貨或換貨流程之前，我們將評估收到的貨物。 如果您對退貨或換貨有任何疑問或需要進一步幫助，請隨時通過以下方式聯絡我們： [email protected]

關於包裝

在包裝方面，我們的產品均精心包裝在防靜電袋中，以提供ESD防靜電保護。 外包裝堅固耐用且閉合牢固。 我們支持各種包裝方法，例如捲帶式、切帶式、管式或託盤式。

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例子

捲帶式

捲帶式

剪膠帶

剪膠帶

管或託盤

管或託盤

H5AN8G8NCJR-VKC 數據表
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目前的價格方案正在編制中。請聯絡我們的客戶服務團隊獲取最新的價格資訊。感謝您的理解和支援!

快速報價

請提交詢價 H5AN8G8NCJR-VKC 或發送電子郵件給我們： Email: [email protected], 我們將在 12 小時內與您聯繫。

詳細說明

Introduction to H5AN8G8NCJR-VKC

The H5AN8G8NCJR-VKC is a high-speed, low-power, Double Data Rate 4 (DDR4) Synchronous DRAM (SDRAM) IC manufactured by SK Hynix. This IC is designed to offer high-speed data transfer rates and low power consumption, making it suitable for use in high-performance computing, networking, and automotive applications where fast and efficient memory access is essential.

Specs and Features

  • Memory Type: Double Data Rate 4 (DDR4) Synchronous DRAM (SDRAM) with high-speed data transfer rates.
  • Capacity: 8 Gigabit (1 Gigabyte) capacity for storing large amounts of data and program instructions.
  • Data Transfer Rate: Offers high-speed data transfer rates for improved system performance.
  • Low Power Consumption: Designed for energy-efficient operation, reducing power consumption in electronic systems.
  • Operating Voltage: Supports standard operating voltage for DDR4 memory modules for seamless integration.
  • Package Type: Available in standard BGA (Ball Grid Array) package for reliable solder connections and space efficiency.

Application and Uses

The H5AN8G8NCJR-VKC is ideal for applications requiring high-speed and low-power memory solutions:

  • High-Performance Computing: Used in servers, workstations, and supercomputers for fast data processing and high-bandwidth memory access.
  • Networking Equipment: Integrated into routers, switches, and network appliances for efficient data packet handling and high-speed caching.
  • Automotive Infotainment Systems: Applied in automotive multimedia systems for quick data access and seamless multimedia streaming.
  • Industrial Control Systems: Utilized in automation and control systems for rapid data storage and retrieval in real-time applications.

Equivalent Part

For similar functionalities, consider these alternatives to the H5AN8G8NCJR-VKC:

  • MT40A1G8SA-075E: DDR4 SDRAM IC with high-speed data transfer rates and low power operation for computing and networking applications.
  • NT5CC256M16DP-DI: Low-power DDR4 SDRAM IC offering high-density memory storage and energy-efficient performance for embedded systems.

規格

以下是所選零件的基本參數，涉及零件的特性及其所屬類別。

Rohs Code Yes Part Life Cycle Code Active
Ihs Manufacturer SK HYNIX INC Package Description FBGA-78
Reach Compliance Code compliant ECCN Code EAR99
HTS Code ! 8542.32.00.36 Access Mode ! MULTI BANK PAGE BURST
Additional Feature ! AUTO/SELF REFRESH JESD-30 Code R-PBGA-B78
Length 11 mm Memory Density 8589934592 bit
Memory IC Type DDR4 DRAM Memory Width 8
Number of Functions 1 Number of Ports ! 1
Number of Terminals 78 Number of Words 1073741824 words
Number of Words Code 1000000000 Operating Mode ! SYNCHRONOUS
Operating Temperature-Max 85 °C Organization 1GX8
Package Body Material PLASTIC/EPOXY Package Code TFBGA
Package Shape RECTANGULAR Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED Seated Height-Max 1.2 mm
Self Refresh YES Supply Voltage-Max (Vsup) 1.26 V
Supply Voltage-Min (Vsup) 1.14 V Supply Voltage-Nom (Vsup) 1.2 V
Surface Mount ! YES Technology CMOS
Temperature Grade ! OTHER Terminal Form ! BALL
Terminal Pitch ! 0.8 mm Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED Width 7.5 mm

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