H5TQ2G83EFR-PBC

Optimized for high-density, low-power consumption usage
3,303 有效庫存

H5TQ2G83EFR-PBC

有效庫存3,303

Optimized for high-density, low-power consumption usage

  • 製造商零件號 # : H5TQ2G83EFR-PBC

  • 製造商: Sk Hynix Inc

  • 產品分類 : Application Specific Clock/Timing

品質保證

品質保證

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認證

我們已成功獲得各項認證標準，並建立了自己的專業檢測實驗室。 這確保了我們向客戶提供的每件產品都符合最高的品質標準。 我們遵守嚴格的測試協議，以保持我們產品的一致性和準確性。 為了確保我們的產品是原裝正品，我們還與信譽良好的第三方檢測機構合作進行嚴格的品質測試。 我們對品質的承諾延伸到滿足行業、法律、監管和 ISO 9001:2015 的要求。

運輸與付款

運輸與付款

關於運送

我們通常會在幾個工作日內通過可靠的運輸公司（例如 FedEx、SF、UPS 或 DHL）運送訂單。 我們還支持其他運輸方式。 如果您想詢問具體的運輸細節或費用，請隨時與我們聯繫。

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關於付款

我們接受多種支付方式，包括VISA、MasterCard、銀聯、西聯、PayPal等渠道。

如果您有特定的付款方式或想詢問費率和其他詳細信息，請隨時與我們聯繫。

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電匯

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Paypal

cc

信用卡

western

西聯匯款

mg

速匯金

服務與包裝

服務與包裝

About After Sales Service

All Parts Extended Quality Guarantee

自發貨之日起 90 天內發起申請。

與我們的工作人員確認退貨或換貨。

保持貨物收到時的原始狀態。

最後請注意，退貨或換貨的資格取決於對退貨商品實際狀況的評估。 在完成退貨或換貨流程之前，我們將評估收到的貨物。 如果您對退貨或換貨有任何疑問或需要進一步幫助，請隨時通過以下方式聯絡我們： [email protected]

關於包裝

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例子

捲帶式

捲帶式

剪膠帶

剪膠帶

管或託盤

管或託盤

H5TQ2G83EFR-PBC 數據表
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目前的價格方案正在編制中。請聯絡我們的客戶服務團隊獲取最新的價格資訊。感謝您的理解和支援!

快速報價

請提交詢價 H5TQ2G83EFR-PBC 或發送電子郵件給我們： Email: [email protected], 我們將在 12 小時內與您聯繫。

詳細說明

Introduction to H5TQ2G83EFR-PBC

The H5TQ2G83EFR-PBC is a high-speed mobile DDR SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) IC manufactured by SK Hynix. This IC is designed for use in mobile devices and high-performance applications that require low power consumption and high data transfer rates. With its compact form factor and efficient operation, the H5TQ2G83EFR-PBC is ideal for enhancing the memory performance of mobile phones, tablets, and other portable electronic devices.

Specs and Features

  • Memory Type: Mobile DDR SDRAM for low-power, high-speed data storage and retrieval.
  • Capacity: Available in various capacities to suit the memory requirements of different devices.
  • Data Transfer Rate: High-speed data transfer with double data rate operation for improved system performance.
  • Low Power Operation: Optimized for low power consumption, extending the battery life of mobile devices.
  • Package Type: Offered in compact and space-saving packaging for integration into mobile devices with limited space.
  • Operating Voltage: Designed to operate within the voltage range of mobile devices, ensuring compatibility and reliability.

Application and Uses

The H5TQ2G83EFR-PBC is suitable for diverse applications in mobile and portable electronics:

  • Smartphones and Tablets: Enhances the multitasking and data processing capabilities of mobile devices for seamless user experience.
  • Portable Gaming Devices: Improves the gaming performance and graphics rendering in handheld gaming consoles and devices.
  • Embedded Systems: Used in compact embedded systems and IoT devices requiring high-speed memory for data processing and storage.
  • Portable Media Players: Enables smooth multimedia playback and storage in portable media devices and entertainment gadgets.

Equivalent Part

For similar functionalities, consider these alternatives to the H5TQ2G83EFR-PBC:

  • MT53B256M32D2DS: Mobile DDR SDRAM IC with high density and low power consumption for mobile and embedded applications.
  • LPDDR4X: Low-power DDR4 SDRAM IC offering high-speed data transfer and energy-efficient operation for mobile and IoT devices.

規格

以下是所選零件的基本參數，涉及零件的特性及其所屬類別。

Rohs Code Yes Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC Part Package Code BGA
Package Description TFBGA, BGA78,9X13,32 Pin Count ! 78
Reach Compliance Code compliant ECCN Code EAR99
HTS Code ! 8542.32.00.36 Access Mode ! MULTI BANK PAGE BURST
Access Time-Max 0.225 ns Additional Feature ! AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 800 MHz I/O Type COMMON
Interleaved Burst Length 4,8 JESD-30 Code R-PBGA-B78
Length 11 mm Memory Density 2147483648 bit
Memory IC Type DDR3 DRAM Memory Width 8
Number of Functions 1 Number of Ports ! 1
Number of Terminals 78 Number of Words 268435456 words
Number of Words Code 256000000 Operating Mode ! SYNCHRONOUS
Operating Temperature-Max 85 °C Organization 256MX8
Output Characteristics 3-STATE Package Body Material PLASTIC/EPOXY
Package Code TFBGA Package Equivalence Code BGA78,9X13,32
Package Shape RECTANGULAR Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED Power Supplies ! 1.5 V
Qualification Status ! Not Qualified Refresh Cycles 8192
Seated Height-Max 1.2 mm Self Refresh YES
Sequential Burst Length 4,8 Standby Current-Max 0.012 A
Supply Current-Max 0.13 mA Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount ! YES Technology CMOS
Temperature Grade ! OTHER Terminal Form ! BALL
Terminal Pitch ! 0.8 mm Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED Width 7.5 mm

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