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產品對比: W971GG6JB-25I vs W971GG6KB-25I vs W971GG6KB25I
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零件號
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| Manufacturer | WINBOND | WINBOND | WINBOND |
| Package | FBGA-84 | BGA-84 | 84-TFBGA |
| Description | This product is ROHS compliant, ensuring that it meets the environmental standards for hazardous substances | IC DRAM 1GBIT PARALLEL 84WBGA | W971GG6KB25I from Winbond Electronics Corporation |
| Stock | 6541 | 6940 | 6974 |
| Technology | CMOS | SDRAM - DDR2 | SDRAM - DDR2 |
| Category | Integrated Circuits (ICs)MemoryMemory | Integrated Circuits (ICs)MemoryMemory | |
| Mfr | Winbond Electronics | Winbond Electronics | |
| Series | - | - | |
| Product Status | Obsolete | Obsolete | |
| Programmable | Not Verified | Not Verified | |
| Memory Type | Volatile | Volatile | |
| Memory Format | DRAM | DRAM | |
| Memory Size | 1Gbit | 1Gbit | |
| Memory Organization | 64M x 16 | 64M x 16 | |
| Memory Interface | Parallel | Parallel | |
| Clock Frequency | 200 MHz | 200 MHz | |
| Write Cycle Time - Word, Page | 15ns | 15ns | |
| Access Time | 400 ps | 400 ps | |
| Voltage - Supply | 1.7V ~ 1.9V | 1.7V ~ 1.9V | |
| Operating Temperature | -40°C ~ 95°C (TC) | -40°C ~ 95°C (TC) | |
| Mounting Type | Surface Mount | Surface Mount | |
| Package / Case | 84-TFBGA | 84-TFBGA | |
| Supplier Device Package | 84-WBGA (8x12.5) | 84-WBGA (8x12.5) | |
| Base Product Number | W971GG6 | W971GG6 | |
| Rohs Code | Yes | ||
| Part Life Cycle Code | Obsolete | ||
| Part Package Code | BGA | ||
| Pin Count | 84 | ||
| Reach Compliance Code | compliant | ||
| ECCN Code | EAR99 | ||
| HTS Code | 8542.32.00.32 | ||
| Access Mode | MULTI BANK PAGE BURST | ||
| Access Time-Max | 0.4 ns | ||
| Additional Feature | AUTO/SELF REFRESH | ||
| Clock Frequency-Max (fCLK) | 400 MHz | ||
| I/O Type | COMMON | ||
| Interleaved Burst Length | 4,8 | ||
| JESD-30 Code | R-PBGA-B84 | ||
| Length | 12.5 mm | ||
| Memory Density | 1073741824 bit | ||
| Memory IC Type | DDR2 DRAM | ||
| Memory Width | 16 | ||
| Number of Functions | 1 | ||
| Number of Ports | 1 | ||
| Number of Terminals | 84 | ||
| Number of Words | 67108864 words | ||
| Number of Words Code | 64000000 | ||
| Operating Mode | SYNCHRONOUS | ||
| Operating Temperature-Max | 85 °C | ||
| Operating Temperature-Min | -40 °C | ||
| Organization | 64MX16 | ||
| Output Characteristics | 3-STATE | ||
| Package Body Material | PLASTIC/EPOXY | ||
| Package Code | TFBGA | ||
| Package Equivalence Code | BGA84,9X15,32 | ||
| Package Shape | RECTANGULAR | ||
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | ||
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | ||
| Power Supplies | 1.8 V | ||
| Qualification Status | Not Qualified | ||
| Refresh Cycles | 8192 | ||
| Seated Height-Max | 1.2 mm | ||
| Self Refresh | YES | ||
| Sequential Burst Length | 4,8 | ||
| Standby Current-Max | 0.01 A | ||
| Supply Current-Max | 0.225 mA | ||
| Supply Voltage-Max (Vsup) | 1.9 V | ||
| Supply Voltage-Min (Vsup) | 1.7 V | ||
| Supply Voltage-Nom (Vsup) | 1.8 V | ||
| Surface Mount | YES | ||
| Temperature Grade | INDUSTRIAL | ||
| Terminal Form | BALL | ||
| Terminal Pitch | 0.8 mm | ||
| Terminal Position | BOTTOM | ||
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | ||
| Width | 8 mm |
零件號
關鍵字: W971G
零件號 "W971G" 回傅 20 個結果; 所有結果都匹配且頭部為 "W971G".
| 零件號 | 描述 | 製造商 | 包裝/箱 | 生命週期狀態 | 貨物週期 | 有存貨 | 操作 |
|---|---|---|---|---|---|---|---|
| W971GG6SB25I |
DDR Synchronous Dynamic Random-Access Memory |
Winbond Electronics | BGA | 3~7 天 | 5,573.00 | ||
| W971GG8SS-25 TR |
High-performance DDR2 memory chip for reliable data storage |
Winbond Electronics | TFBGA-60 | 3~7 天 | 6,526.00 | ||
| W971GG8NB-18 |
High-density memory module suitable for industrial control systems |
Winbond Electronics | WBGA-84 | 3~7 天 | 4,817.00 | ||
| W971GG8NB-18I TR |
Industrial-Strength RAM: 1GB DDR2, Operating Temperature Range -20°C to 100°C, RoHS Compliant |
Winbond Electronics | WBGA-84 | 3~7 天 | 2,402.00 | ||
| W971GG6NB-18 TR |
Enhance System Performance with Advanced SDRAM Technology |
Winbond Electronics | WBGA-84 | 3~7 天 | 2,156.00 | ||
| W971GG8NB-25 TR |
Compact 8x9.5 design ideal for space-constrained applications |
Winbond Electronics | WBGA-84 | 3~7 天 | 7,064.00 | ||
| W971GG6SB-18 |
High-quality memory upgrade for improved system performance and capacity |
Winbond Electronics | TFBGA-84 | 3~7 天 | 3,250.00 | ||
| W971GG6KB-18 |
.ns access time maximizes system responsivenes |
Winbond Electronics | TFBGA-84 | 3~7 天 | 2,271.00 | ||
| W971GG6NB-25 |
DDR2 SDRAM 1Gbit DRAM Chip |
Winbond | WBGA-84 | ACTIVE | 3~7 天 | 7,577.00 | |
| W971GG8NB-25 |
Product type: SDRAM |
Winbond Electronics | VFBGA-60 | 3~7 天 | 7,102.00 | ||
| W971GG8KB25I TR |
Compact 60-WBGA (8x12.5) form factor |
Winbond Electronics | 60-TFBGA | 3~7 天 | 4,796.00 | ||
| W971GG8KB-25 TR |
1Gbit capacity with 200 MHz speed for seamless multitasking |
Winbond Electronics | 60-TFBGA | 3~7 天 | 2,639.00 | ||
| W971GG6KB25I TR |
High-speed DDR2 memory IC for efficient data processing |
Winbond Electronics | 84-TFBGA | 3~7 天 | 7,043.00 | ||
| W971GG6KB-25 TR |
Advanced SDRAM technology for fast data transfer rat |
Winbond Electronics | 84-TFBGA | 3~7 天 | 4,084.00 | ||
| W971GG6KB-18 TR |
Advanced memory technology for seamless computing experience |
Winbond Electronics | 84-TFBGA | 3~7 天 | 2,737.00 | ||
| W971GG8SB25I TR |
Ideal for use in servers, workstations, and other high-performance device |
Winbond Electronics | 60-TFBGA | 3~7 天 | 4,577.00 | ||
| W971GG8SB-25 TR |
High-quality DDR2 SDRAM chip with 1Gbit capacity in 60-Pin WBGA package |
Winbond Electronics | 60-TFBGA | 3~7 天 | 6,018.00 | ||
| W971GG6SB25I TR |
Advanced memory solution for industrial control systems, suitable for harsh environment |
Winbond Electronics | 84-TFBGA | 3~7 天 | 7,740.00 | ||
| W971GG6SB-18 TR |
Boost performance with the 64Mx16 configuration and 1.8V power |
Winbond Electronics | 84-TFBGA | 3~7 天 | 3,859.00 | ||
| W971GG8SS25I |
Robust RAM solution for demanding applications and multitaskin |
Winbond Electronics | 60-TFBGA | 3~7 天 | 6,641.00 |