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產品對比: W9412G6JH vs W9412G6JH-4 vs W9412G6IH-5
隱藏相同的屬性
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零件號
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| Manufacturer | Winbond | WINBOND | WINBOND |
| Package | Packaged | TSSOP-66 | TSOP54 |
| Description | W9412G6JH is a high-speed DDR2 SDRAM chip with 512MB capacity. | High-performance computing solutions | TSOP2-66 DDR DRAM module with 0.400 inch width and PDSO66 configuration |
| Stock | 5922 | 3618 | 4204 |
| Technology | SDRAM - DDR | CMOS | CMOS |
| Rohs Code | Yes | Yes | |
| Part Life Cycle Code | Obsolete | Obsolete | |
| Part Package Code | TSOP2 | TSOP2 | |
| Pin Count | 66 | 66 | |
| Reach Compliance Code | compliant | ||
| ECCN Code | EAR99 | EAR99 | |
| HTS Code | 8542.32.00.02 | 8542.32.00.02 | |
| Access Mode | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | |
| Access Time-Max | 0.65 ns | 0.7 ns | |
| Additional Feature | AUTO/SELF REFRESH | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 250 MHz | 200 MHz | |
| I/O Type | COMMON | COMMON | |
| Interleaved Burst Length | 2,4,8 | 2,4,8 | |
| JESD-30 Code | R-PDSO-G66 | R-PDSO-G66 | |
| Length | 22.22 mm | 22.22 mm | |
| Memory Density | 134217728 bit | 134217728 bit | |
| Memory IC Type | DDR1 DRAM | DDR1 DRAM | |
| Memory Width | 16 | 16 | |
| Number of Functions | 1 | 1 | |
| Number of Ports | 1 | 1 | |
| Number of Terminals | 66 | 66 | |
| Number of Words | 8388608 words | 8388608 words | |
| Number of Words Code | 8000000 | 8000000 | |
| Operating Mode | SYNCHRONOUS | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | 70 °C | |
| Organization | 8MX16 | 8MX16 | |
| Output Characteristics | 3-STATE | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | |
| Package Code | TSOP2 | TSOP2 | |
| Package Equivalence Code | TSSOP66,.46 | TSSOP66,.46 | |
| Package Shape | RECTANGULAR | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | NOT SPECIFIED | |
| Power Supplies | 2.5 V | 2.5 V | |
| Qualification Status | Not Qualified | Not Qualified | |
| Refresh Cycles | 4096 | 4096 | |
| Seated Height-Max | 1.2 mm | 1.2 mm | |
| Self Refresh | YES | YES | |
| Sequential Burst Length | 2,4,8 | 2,4,8 | |
| Standby Current-Max | 0.005 A | 0.02 A | |
| Supply Current-Max | 0.17 mA | 0.32 mA | |
| Supply Voltage-Max (Vsup) | 2.7 V | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | 2.5 V | |
| Surface Mount | YES | YES | |
| Temperature Grade | COMMERCIAL | COMMERCIAL | |
| Terminal Form | GULL WING | GULL WING | |
| Terminal Pitch | 0.65 mm | 0.65 mm | |
| Terminal Position | DUAL | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | NOT SPECIFIED | |
| Width | 10.16 mm | 10.16 mm | |
| Category | Integrated Circuits (ICs)MemoryMemory | ||
| Mfr | Winbond Electronics | ||
| Series | - | ||
| Product Status | Obsolete | ||
| Programmable | Not Verified | ||
| Memory Type | Volatile | ||
| Memory Format | DRAM | ||
| Memory Size | 128Mbit | ||
| Memory Organization | 8M x 16 | ||
| Memory Interface | Parallel | ||
| Clock Frequency | 200 MHz | ||
| Write Cycle Time - Word, Page | 15ns | ||
| Access Time | 50 ns | ||
| Voltage - Supply | 2.3V ~ 2.7V | ||
| Operating Temperature | -40°C ~ 85°C (TA) | ||
| Mounting Type | Surface Mount | ||
| Package / Case | 66-TSSOP (0.400", 10.16mm Width) | ||
| Supplier Device Package | 66-TSOP II | ||
| Base Product Number | W9412G6 |
零件號
關鍵字: W9412
零件號 "W9412" 回傅 20 個結果; 所有結果都匹配且頭部為 "W9412".
| 零件號 | 描述 | 製造商 | 包裝/箱 | 生命週期狀態 | 貨物週期 | 有存貨 | 操作 |
|---|---|---|---|---|---|---|---|
| W9412G6KH-5 |
TSOP-66-10.2mm DDR SDRAM with environmental-friendly ROHS certification |
WINBOND | TSOP-66 | Active | 3~7 天 | 3,283.00 | |
| W9412G6JH-5 |
DDR DRAM, 8MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, TSOP2-66 |
WINBOND | TSOP66 | 3~7 天 | 7,909.00 | ||
| W9412G6JB-5I TR |
Compact and efficient, this memory module is perfect for applications where space is a concer |
Winbond Electronics | TFBGA-60 | 3~7 天 | 4,685.00 | ||
| W9412G6KH-4 TR |
Boost your system's speed with this 128Mbit parallel module |
Winbond Electronics | TSSOP-66 | 3~7 天 | 4,715.00 | ||
| W9412G6KH-5 TR |
Low-power, high-capacity DRAM for improved system reliability |
Winbond Electronics | TSOP-66 | 3~7 天 | 4,728.00 | ||
| W9412G6JH-5I |
Reliable and efficient -TSOP II package for compact and secure storag |
Winbond Electronics | TSSOP-66 | 3~7 天 | 4,552.00 | ||
| W9412G6JB-5 |
High-performance memory for demanding application |
Winbond | TFBGA-60 | 3~7 天 | 5,951.00 | ||
| W9412G6KH-5I TR |
b DDR SDRAM module for reliable performanc |
Winbond | TSOP-66 | 3~7 天 | 3,174.00 | ||
| W9412G6KH-5I |
Fast Hz speed for data-intensive workloa |
Winbond | TSOP-66 | 3~7 天 | 7,088.00 | ||
| W941232AD-5 |
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WINBOND | QFP | 3~7 天 | 1,008.00 | ||
| W941232AD-6 |
|
WINBOND | QFP | 3~7 天 | 236.00 | ||
| W941232DA-5 |
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WINBOND | 3~7 天 | 5,000.00 | |||
| W9412G21B-4 |
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WINBAND | BGA | 3~7 天 | 14.00 | ||
| W9412G21B-5 |
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WINBOND | BGA | 3~7 天 | 21.00 | ||
| W9412G2CB |
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WINBOND | 3~7 天 | 1,773.00 | |||
| W9412G2CB-45 |
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WI | BGA | 3~7 天 | 12.00 | ||
| W9412G2CB-5 |
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WINBOND | BGA | 3~7 天 | 50.00 | ||
| W9412G2CB-6 |
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WINBOND | QFP | 3~7 天 | 11,795.00 | ||
| W9412G2IB-4 |
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WINBOND | TQFP-48 | 3~7 天 | 2,037.00 | ||
| W9412G2IB-5 |
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WINBOND | TSOP66 | 3~7 天 | 5,781.00 |