恭喜您提交成功
提交失敗
產品對比: K9F2G08U0A-PIB0 vs K9F2G08U0B-PIB0 vs K9F2G08R0A-JIB0
隱藏相同的屬性
|
全部
零件號
|
|
|
|
|---|---|---|---|
| Manufacturer | SAMSUNG | SAMSUNG | SAMSUNG |
| Package | TSOP48 | TSOP-48 | FBGA63 |
| Description | Flash, 256MX8, 20ns, PDSO48, | SLC NAND Flash Parallel 3.3V 2G-bit 256M x 8 48-Pin TSOP-I | A flash memory chip designated as K9F2G08R0A-JIB0 |
| Stock | 6947 | 6341 | 4590 |
| Rohs Code | Yes | Yes | |
| Part Life Cycle Code | Obsolete | Obsolete | |
| ECCN Code | EAR99 | EAR99 | |
| HTS Code | 8542.32.00.51 | 8542.32.00.51 | |
| Access Time-Max | 20 ns | 30 ns | |
| Command User Interface | YES | YES | |
| Data Polling | NO | NO | |
| JESD-30 Code | R-PDSO-G48 | R-PBGA-B63 | |
| JESD-609 Code | e6 | e1 | |
| Memory Density | 2147483648 bit | 2147483648 bit | |
| Memory IC Type | FLASH | FLASH | |
| Memory Width | 8 | 8 | |
| Moisture Sensitivity Level | 3 | 3 | |
| Number of Sectors/Size | 2K | 2K | |
| Number of Terminals | 48 | 63 | |
| Number of Words | 268435456 words | 268435456 words | |
| Number of Words Code | 256000000 | 256000000 | |
| Operating Temperature-Max | 85 °C | 85 °C | |
| Operating Temperature-Min | -40 °C | -40 °C | |
| Organization | 256MX8 | 256MX8 | |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | |
| Package Code | TSSOP | FBGA | |
| Package Equivalence Code | TSSOP48,.8,20 | BGA63,10X12,32 | |
| Package Shape | RECTANGULAR | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, FINE PITCH | |
| Page Size | 2K words | 2K words | |
| Parallel/Serial | PARALLEL | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | 260 | |
| Power Supplies | 3/3.3 V | 1.8 V | |
| Qualification Status | Not Qualified | Not Qualified | |
| Ready/Busy | YES | YES | |
| Sector Size | 128K | 128K | |
| Standby Current-Max | 0.00005 A | 0.00005 A | |
| Supply Current-Max | 0.02 mA | 0.03 mA | |
| Surface Mount | YES | YES | |
| Technology | CMOS | CMOS | |
| Temperature Grade | INDUSTRIAL | INDUSTRIAL | |
| Terminal Finish | TIN BISMUTH | TIN SILVER COPPER | |
| Terminal Form | GULL WING | BALL | |
| Terminal Pitch | 0.5 mm | 0.8 mm | |
| Terminal Position | DUAL | BOTTOM | |
| Toggle Bit | NO | NO | |
| Pbfree Code | Yes | ||
| Type | SLC NAND TYPE | ||
| Product Category | IC Chips | ||
| Supply Voltage-Nom (Vsup) | 1.8 V |
零件號
關鍵字: K9F2G
零件號 "K9F2G" 回傅 20 個結果; 所有結果都匹配且頭部為 "K9F2G".
| 零件號 | 描述 | 製造商 | 包裝/箱 | 生命週期狀態 | 貨物週期 | 有存貨 | 操作 |
|---|---|---|---|---|---|---|---|
| K9F2G08U0A-PCB0 |
48-pin plastic dual in-line package, 20ns access time |
SAMSUNG | TSOP-48 | 3~7 天 | 3,881.00 | ||
| K9F2G08U0C-SIB0 |
|
SAMSUNG | TSOP-48 | 3~7 天 | 7,546.00 | ||
| K9F2G08U0B-PCB0 |
SLC NAND Flash Parallel 3.3V 2G-bit 256M x 8 48-Pin TSOP-I |
SAMSUNG | TSOP-48 | 3~7 天 | 3,995.00 | ||
| K9F2G08UOM |
|
SAMSUNG | TSSOP | 3~7 天 | 5,874.00 | ||
| K9F2G08UOC |
|
SAMSUNG | TSOP48 | 3~7 天 | 7,341.00 | ||
| K9F2G0808U0M-YCB0 |
|
SAMSUNG | TSOP | 3~7 天 | 3,500.00 | ||
| K9F2G08R0A-J |
|
SAMSUNG | BGA | 3~7 天 | 102.00 | ||
| K9F2G08R0A-JCB0 |
|
SAMSUNG | BGA63 | 3~7 天 | 1,050.00 | ||
| K9F2G08R0A-JIB0 |
|
SAMSUNG | FBGA63 | 3~7 天 | 1,803.00 | ||
| K9F2G08R0A-JIB00 |
|
SAMSUNG | FBGA | 3~7 天 | 9,800.00 | ||
| K9F2G08R0A-PCB0 |
|
SAMSUNG | 3~7 天 | 5,442.00 | |||
| K9F2G08U0A-IIB0 |
|
SAMSUNG | LGA53 | 3~7 天 | 549.00 | ||
| K9F2G08U0A-P |
|
SAMSUNG | TSSOP | 3~7 天 | 2,113.00 | ||
| K9F2G08U0A-PCB0000 |
|
SAMSUNG | TSOP | 3~7 天 | 15,000.00 | ||
| K9F2G08U0A-PCB0T |
|
SAMSUNG | TSOP48 | 3~7 天 | 90.00 | ||
| K9F2G08U0A-PIB0 |
|
SAMSUNG | TSOP48 | 3~7 天 | 698.00 | ||
| K9F2G08U0A-YCB0 |
|
SAMSUNG | TSOP48 | 3~7 天 | 2,500.00 | ||
| K9F2G08U0A-WJ |
|
SAMSUNG | 3~7 天 | 1,823.00 | |||
| K9F2G08U0A-YIB0 |
|
SAMSUNG | TSOP48 | 3~7 天 | 2,500.00 | ||
| K9F2G08U0B-PIB0 |
|
SAMSUNG | TSOP-48 | 3~7 天 | 368.00 |