K9F2G08R0A-JIB0
A flash memory chip designated as K9F2G08R0A-JIB0K9F2G08R0A-JIB0
A flash memory chip designated as K9F2G08R0A-JIB0
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K9F2G08R0A-JIB0 數據表
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詳細說明
GENERAL DESCRIPTION Offered in 256Mx8bit, the K9F2G08X0A is a 2G-bit NAND Flash Memory with spare 64M-bit. Its NAND cell provides the most cost effective solution for the solid state application market. A program operation can be performed in typical 200µs on the (2K+64)Byte page and an erase operation can be performed in typical 1.5ms on a (128K+4K)Byte block. Data in the data register can be read out at 25ns(42ns with 1.8V device) cycle time per Byte. The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9F2G08X0A′s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9F2G08X0A is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility.FEATURES • Voltage Supply - 1.65V ~ 1.95V - 2.70V ~ 3.60V • Organization - Memory Cell Array : (256M + 8M) x 8bit - Data Register : (2K + 64) x 8bit • Automatic Program and Erase - Page Program : (2K + 64)Byte - Block Erase : (128K + 4K)Byte • Page Read Operation - Page Size : (2K + 64)Byte - Random Read : 25µs(Max.) - Serial Access : 25ns(Min.) (*K9F2G08R0A: tRC = 42ns(Min)) • Fast Write Cycle Time - Page Program time : 200µs(Typ.) - Block Erase Time : 1.5ms(Typ.) • Command/Address/Data Multiplexed I/O Port • Hardware Data Protection - Program/Erase Lockout During Power Transitions • Reliable CMOS Floating-Gate Technology -Endurance : 100K Program/Erase Cycles(with 1bit/512Byte ECC) - Data Retention : 10 Years • Command Driven Operation • Intelligent Copy-Back with internal 1bit/528Byte EDC • Unique ID for Copyright Protection • Package : - K9F2G08R0A-JCB0/JIB0 : Pb-FREE PACKAGE 63 - Ball FBGA I (10 x 13 / 0.8 mm pitch) - K9F2G08U0A-PCB0/PIB0 : Pb-FREE PACKAGE 48 - Pin TSOP I (12 x 20 / 0.5 mm pitch) - K9F2G08U0A-ICB0/IIB0 52 - Pin ULGA (12 x 17 / 1.00 mm pitch)
主要特徵
- Voltage Supply
- - 1.65V ~ 1.95V
- - 2.70V ~ 3.60V
- Organization
- - Memory Cell Array : (256M + 8M) x 8bit
- - Data Register : (2K + 64) x 8bit
- Automatic Program and Erase
- - Page Program : (2K + 64)Byte
- - Block Erase : (128K + 4K)Byte
- Page Read Operation
- - Page Size : (2K + 64)Byte
- - Random Read : 25µs(Max.)
- - Serial Access : 25ns(Min.)
- (K9F2G08R0A: tRC = 42ns(Min))
- Fast Write Cycle Time
- - Page Program time : 200µs(Typ.)
- - Block Erase Time : 1.5ms(Typ.)
- Command/Address/Data Multiplexed I/O Port
- Hardware Data Protection
- - Program/Erase Lockout During Power Transitions
- Reliable CMOS Floating-Gate Technology
- -Endurance : 100K Program/Erase Cycles(with 1bit/512Byte
- ECC)
- - Data Retention : 10 Years
- Command Driven Operation
- Intelligent Copy-Back with internal 1bit/528Byte EDC
- Unique ID for Copyright Protection
- Package :
- - K9F2G08R0A-JCB0/JIB0 : Pb-FREE PACKAGE
- 63 - Ball FBGA I (10 x 13 / 0.8 mm pitch)
- - K9F2G08U0A-PCB0/PIB0 : Pb-FREE PACKAGE
- 48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
- - K9F2G08U0A-ICB0/IIB0
- 52 - Pin ULGA (12 x 17 / 1.00 mm pitch)
規格
以下是所選零件的基本參數,涉及零件的特性及其所屬類別。
Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Reach Compliance Code | ECCN Code | EAR99 | |
HTS Code ! | 8542.32.00.51 | Access Time-Max | 30 ns |
Command User Interface | YES | Data Polling | NO |
JESD-30 Code | R-PBGA-B63 | JESD-609 Code | e1 |
Memory Density | 2147483648 bit | Memory IC Type | FLASH |
Memory Width | 8 | Moisture Sensitivity Level | 3 |
Number of Sectors/Size | 2K | Number of Terminals | 63 |
Number of Words | 268435456 words | Number of Words Code | 256000000 |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
Organization | 256MX8 | Package Body Material | PLASTIC/EPOXY |
Package Code | FBGA | Package Equivalence Code | BGA63,10X12,32 |
Package Shape | RECTANGULAR | Package Style | GRID ARRAY, FINE PITCH |
Page Size | 2K words | Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 260 | Power Supplies ! | 1.8 V |
Qualification Status ! | Not Qualified | Ready/Busy | YES |
Sector Size | 128K | Standby Current-Max | 0.00005 A |
Supply Current-Max | 0.03 mA | Supply Voltage-Nom (Vsup) | 1.8 V |
Surface Mount ! | YES | Technology | CMOS |
Temperature Grade ! | INDUSTRIAL | Terminal Finish | TIN SILVER COPPER |
Terminal Form ! | BALL | Terminal Pitch ! | 0.8 mm |
Terminal Position | BOTTOM | Toggle Bit | NO |
Specification Comparison
數據表 PDF
數據表記錄了器件的特性、絕對最大額定值、應用等,這對於作為器件特定應用的整體指南大有裨益。
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