QCA6234X-AM2D
113-Pin LGA Module Chip for WLAN and Bluetooth Combination, IEEE 802.11a/b/g/n, Bluetooth v4.0 (BLE) Class 1.5QCA6234X-AM2D
113-Pin LGA Module Chip for WLAN and Bluetooth Combination, IEEE 802.11a/b/g/n, Bluetooth v4.0 (BLE) Class 1.5
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製造商零件號 # : QCA6234X-AM2D
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包裝/封裝: LGA Module
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零件狀態 : OBSOLETE
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製造商: QUALCOMM
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產品分類 : Combo Wireless Modules
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QCA6234X-AM2D 數據表
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詳細說明
The QCA6234X-AM2D is a highly integrated system-on-chip (SoC) solution developed by Qualcomm Atheros. It is designed for high-performance, low-power consumption applications in the Internet of Things (IoT) market. The QCA6234X-AM2D features a dual-core ARM Cortex-A7 processor with a clock speed of up to 1.3 GHz, making it ideal for handling complex applications and tasks. It also includes an integrated Bluetooth 4.1 and Wi-Fi 802.11 ac/b/g/n radio, providing seamless connectivity options for various devices.With support for dual-band operation (2.4 GHz and 5 GHz), the QCA6234X-AM2D offers enhanced data rates and improved reliability. It also features advanced security features like WPA3 encryption, ensuring secure communication over wireless networks.In addition, the QCA6234X-AM2D includes built-in hardware acceleration for cryptography functions, improving performance and efficiency. It also supports features like wake-on-wireless, allowing devices to stay connected in low-power states and conserve energy.
主要特徵
- Dual-band 2x2 Wi-Fi 6 (802.11ax) + Bluetooth 5.1
- Supports 80MHz channel bandwidth for fast and reliable connections
- Advanced MIMO technology for improved throughput and coverage
- Low-power operation for extended battery life in mobile devices
- Integrated security features for data protection
應用
- Automotive industry: for in-car connectivity and communication systems
- Smart home and IoT devices: for connecting smart appliances and sensors
- Industrial automation: for wireless communication in manufacturing and industrial processes
- Healthcare: for medical devices and applications that require reliable wireless connectivity
- Consumer electronics: for smartphones, tablets, and other portable devices
- Networking equipment: for routers, access points, and other networking devices
規格
以下是所選零件的基本參數,涉及零件的特性及其所屬類別。
ECCN (US) | EAR99 | Part Status ! | Obsolete |
HTS | 8542.31.00.01 | Automotive | |
PPAP | Construction | WLAN+BT | |
Style | Chip | WLAN Maximum Data Rate (MBps) | 144.4 |
WLAN Frequency Range (MHz) | 2412 to 2484|5180 to 5925 | BT Interface | UART |
WLAN Maximum Output Power | 19dBm(Typ) | Minimum Operating Temperature (°C) | -20 |
Maximum Operating Temperature (°C) | 85 | Packaging ! | Tray |
BT Protocol Supported | Bluetooth v4.0(BLE) | WLAN Technology | IEEE 802.11a/b/g/n |
Mounting | Surface Mount | Package Height | 1.04 |
Package Width | 9.2 | Package Length | 9.2 |
PCB changed | 113 | Standard Package Name | LGA |
Supplier Package | LGA Module | Pin Count ! | 113 |
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