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OMAP5910JGDY2
SOC OMAP5 ARM9TDMI/C55x CMOS 289-Pin BGA Tray
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製造商零件號 # : OMAP5910JGDY2
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包裝/封裝: BGA-289
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製造商: Texas Instruments
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產品分類 : Microprocessors
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OMAP5910JGDY2 數據表
目前的價格方案正在編制中。請聯絡我們的客戶服務團隊獲取最新的價格資訊。感謝您的理解和支援!
詳細說明
Connectivity is key with the OMAP5910JGDY2, boasting a plethora of peripherals including USB, I2C, UART, SPI, and MMC interfaces. This ensures seamless integration with a variety of devices and networks, making it a valuable asset for any embedded system. Moreover, the multiple display interfaces, such as LCD and TV-out, make it a versatile choice for a wide array of applications that require high-quality visual output
主要特徵
- This SoC features a 209 MHz digital signal processor
- The OMAP59JGDY2 includes memory and power management features
- It combines a 32-bit ARM926TEJ core with peripheral interfaces
規格
以下是所選零件的基本參數，涉及零件的特性及其所屬類別。
| Arm CPU | 1 Arm9 | Arm (max) (MHz) | 192 |
| Coprocessors | C55x DSP | CPU | 32-bit |
| Hardware accelerators | Motion Estimation for Video Compression, Pixel Interpolation, Video Hardware Accelerators for DCT/iDCT | Operating system | Linux, RTOS |
| Security | Device identity, Memory protection | Rating | Catalog |
| Operating temperature range (°C) | -40 to 85 |
數據表 PDF
數據表記錄了器件的特性、絕對最大額定值、應用等，這對於作為器件特定應用的整體指南大有裨益。
常見問題解答
What is OMAP5910JGDY2?
The OMAP5910JGDY2 is a system-on-chip (SoC) integrated circuit designed by Texas Instruments. It combines a high-performance ARM microprocessor core with various peripherals, making it suitable for embedded and mobile applications such as PDAs, smartphones, and portable multimedia devices.
How Does OMAP5910JGDY2 Work?
The OMAP5910JGDY2 works by integrating a powerful ARM microprocessor core with a range of on-chip peripherals including memory interfaces, display controllers, and communication interfaces. This integration allows for the development of feature-rich, low-power mobile and embedded devices.
How Many Pins does OMAP5910JGDY2 have and What are the Functions of the Pinout Configuration?
The OMAP5910JGDY2 is housed in a ball grid array (BGA) package. The pinout configuration includes a large number of pins, each serving various functions for interfacing with external components, power supplies, and communication interfaces.
What are the Pros and Cons of OMAP5910JGDY2?
Pros:
- High Performance: Integrates a powerful ARM microprocessor core for demanding applications.
- Rich Peripheral Set: Includes a range of on-chip peripherals for building feature-rich systems.
- Low Power Consumption: Suitable for battery-powered and portable devices.
- Integrated Design: Reduces the need for external components and simplifies system design.
- Flexibility: Supports a variety of embedded and mobile applications.
Cons:
- Complexity: Designing with a highly integrated SoC may require careful consideration of power management, heat dissipation, and signal integrity.
- Cost: Higher integration and performance may come with a higher cost compared to simpler microcontrollers or processors.
- Package Handling: The ball grid array (BGA) package may require special handling and assembly techniques.
Are There Any Equivalents/Alternatives to OMAP5910JGDY2 for Recommendation?
Similar alternatives to the OMAP5910JGDY2 include the Snapdragon series from Qualcomm and the i.MX series from NXP Semiconductors.
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