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產品對比: W9864G6KH-5 vs W9864G6IH vs W9864G6JH-6I
隱藏相同的屬性
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零件號
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| Manufacturer | WINBOND | WINBOND | Winbond |
| Package | 54-TSOP II | TSOP | 54-TSOP |
| Description | TSOP-54-10.2mm SDRAM ROHS | IC DRAM 64MBIT PAR 54TSOP II | RoHS compliant manufacturing process |
| Stock | 3118 | 3935 | 5444 |
| Technology | CMOS | SDRAM | |
| Rohs Code | Yes | ||
| Part Life Cycle Code | Active | ||
| Reach Compliance Code | compliant | ||
| ECCN Code | EAR99 | ||
| HTS Code | 8542.32.00.02 | ||
| Access Mode | FOUR BANK PAGE BURST | ||
| Access Time-Max | 4.5 ns | ||
| Additional Feature | AUTO/SELF REFRESH | ||
| JESD-30 Code | R-PDSO-G54 | ||
| Length | 22.22 mm | ||
| Memory Density | 67108864 bit | ||
| Memory IC Type | SYNCHRONOUS DRAM | ||
| Memory Width | 16 | ||
| Number of Functions | 1 | ||
| Number of Ports | 1 | ||
| Number of Terminals | 54 | ||
| Number of Words | 4194304 words | ||
| Number of Words Code | 4000000 | ||
| Operating Mode | SYNCHRONOUS | ||
| Operating Temperature-Max | 70 °C | ||
| Organization | 4MX16 | ||
| Package Body Material | PLASTIC/EPOXY | ||
| Package Code | TSOP2 | ||
| Package Shape | RECTANGULAR | ||
| Package Style | SMALL OUTLINE, THIN PROFILE | ||
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | ||
| Seated Height-Max | 1.2 mm | ||
| Self Refresh | YES | ||
| Supply Voltage-Max (Vsup) | 3.6 V | ||
| Supply Voltage-Min (Vsup) | 3 V | ||
| Supply Voltage-Nom (Vsup) | 3.3 V | ||
| Surface Mount | YES | ||
| Temperature Grade | COMMERCIAL | ||
| Terminal Form | GULL WING | ||
| Terminal Pitch | 0.8 mm | ||
| Terminal Position | DUAL | ||
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | ||
| Width | 10.16 mm | ||
| Category | Integrated Circuits (ICs)MemoryMemory | ||
| Mfr | Winbond Electronics | ||
| Series | - | ||
| Product Status | Obsolete | ||
| Programmable | Not Verified | ||
| Memory Type | Volatile | ||
| Memory Format | DRAM | ||
| Memory Size | 64Mbit | ||
| Memory Organization | 4M x 16 | ||
| Memory Interface | Parallel | ||
| Clock Frequency | 166 MHz | ||
| Write Cycle Time - Word, Page | - | ||
| Access Time | 5 ns | ||
| Voltage - Supply | 3V ~ 3.6V | ||
| Operating Temperature | 0°C ~ 70°C (TA) | ||
| Mounting Type | Surface Mount | ||
| Package / Case | 54-TSOP (0.400", 10.16mm Width) | ||
| Supplier Device Package | 54-TSOP II | ||
| Base Product Number | W9864G6 | ||
| Product Category | DRAM | ||
| Brand | Winbond | ||
| Product Type | DRAM | ||
| Subcategory | Memory & Data Storage |
零件號
關鍵字: W9864
零件號 "W9864" 回傅 20 個結果; 所有結果都匹配且頭部為 "W9864".
| 零件號 | 描述 | 製造商 | 包裝/箱 | 生命週期狀態 | 貨物週期 | 有存貨 | 操作 |
|---|---|---|---|---|---|---|---|
| W9864G2JH-6 |
64Mb DRAM, SDR SDRAM, x32, operating at 166MHz, manufactured using 65nm technology |
WINBOND | TSOP86 | 3~7 天 | 6,759.00 | ||
| W9864G6JT-6 |
MX16 capacity, 5ns latency, PBGA54, TFBGA-54 |
Winbond | 54-TFBGA | 3~7 天 | 3,953.00 | ||
| W9864G6JT |
IC DRAM 64MBIT LVTTL 54TFBGA |
Winbond | TFBGA-54 | 3~7 天 | 5,621.00 | ||
| W9864G6JH |
IC DRAM 64MBIT PAR 54TSOP II |
WINBOND | TSOP-54 | 3~7 天 | 7,774.00 | ||
| W9864G2GH-7 |
DDR DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 |
WINBOND | TSOP86 | 3~7 天 | 5,093.00 | ||
| W9864G6JT-6 TR |
TFBGA-54(8x8) SDRAM ROHS, designed for efficient data storage |
Winbond Electronics | TFBGA-54 | 3~7 天 | 3,759.00 | ||
| W9864G6KT-6I |
Enhanced memory performance at an affordable price |
Winbond Electronics | TFBGA-54 | 3~7 天 | 4,363.00 | ||
| W9864G6KT-6 |
High-speed RAM module for seamless computing |
Winbond Electronics | TFBGA-54 | 3~7 天 | 6,008.00 | ||
| W9864G6JB-6 TR |
Low-power consumption ensures extended battery life |
Winbond Electronics | VFBGA-60 | 3~7 天 | 3,853.00 | ||
| W9864G6JB-6I TR |
Get high performance with our DRAM 64Mb SDR SDRAM x16, 166MHz |
Winbond Electronics | VFBGA-60 | 3~7 天 | 7,958.00 | ||
| W9864G6JB-6I |
ROHS compliant SDRAM module for environmentally friendly use |
Winbond Electronics | VFBGA-60 | 3~7 天 | 2,636.00 | ||
| W9864G6JB-6 |
Enhance memory capacity with this reliable x16 SDRAM |
Winbond Electronics | VFBGA-60 | 3~7 天 | 6,189.00 | ||
| W9864G6KH-5 TR |
DRAM Chip SDRAM 64Mbit 4Mx16 3.3V 54-Pin TSOP-II |
Winbond Electronics | TSOP-54 | ACTIVE | 3~7 天 | 6,553.00 | |
| W9864G6KH-6 |
High-speed, low-power DRAM chip suitable for various applications |
Winbond Electronics | TSOP-54 | 3~7 天 | 3,449.00 | ||
| W9864G2JB-6I TR |
Optimized for high-speed data transfer and storage needs |
Winbond | TFBGA-90 | 3~7 天 | 3,450.00 | ||
| W9864G2JB-6I |
Upgrade to W9864G2JB-6I for superior memory performance |
Winbond | TFBGA-90 | 3~7 天 | 2,221.00 | ||
| W9864G2JB-6 |
Get high-speed performance with this 64Mb SDR SDRAM |
Winbond | TFBGA-90 | 3~7 天 | 4,346.00 | ||
| W9864G2JH-6I TR |
Large capacity memory module suitable for heavy workload system |
Winbond Electronics | TSOP-86 | NRND | 3~7 天 | 7,599.00 | |
| W9864G6JT-6I TR |
High-performance memory module for demanding systems |
Winbond | TFBGA-54 | 3~7 天 | 5,170.00 | ||
| W9864G6KT-6 TR |
Advanced SDR SDRAM technology for efficient data storag |
Winbond | 54-TFBGA | 3~7 天 | 7,490.00 |