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產品對比: W9812G6JB-6I vs W9812G6JB vs W9812G6IH
隱藏相同的屬性
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零件號
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| Manufacturer | WINBOND | Winbond | WINBOND |
| Package | 54-TFBGA | Packaged | TSOP |
| Description | Synchronous DRAM, 8MX16, 5ns, CMOS, PBGA54, TFBGA-54 | W9812G6JB is a DDR2 SDRAM chip with a capacity of 1Gb. | IC DRAM 128MBIT PAR 54TSOP II |
| Stock | 3195 | 3689 | 7264 |
| Technology | CMOS | SDRAM | SDRAM |
| Category | Integrated Circuits (ICs)MemoryMemory | Integrated Circuits (ICs)MemoryMemory | |
| Mfr | Winbond Electronics | Winbond Electronics | |
| Series | - | - | |
| Product Status | Active | Obsolete | |
| Programmable | Not Verified | Not Verified | |
| Memory Type | Volatile | Volatile | |
| Memory Format | DRAM | DRAM | |
| Memory Size | 128Mbit | 128Mbit | |
| Memory Organization | 8M x 16 | 8M x 16 | |
| Memory Interface | Parallel | Parallel | |
| Clock Frequency | 166 MHz | 166 MHz | |
| Write Cycle Time - Word, Page | - | - | |
| Access Time | 5 ns | 5 ns | |
| Voltage - Supply | 3V ~ 3.6V | 3V ~ 3.6V | |
| Operating Temperature | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) | |
| Mounting Type | Surface Mount | Surface Mount | |
| Package / Case | 54-TFBGA | 54-TSOP (0.400", 10.16mm Width) | |
| Supplier Device Package | 54-TFBGA (8x8) | 54-TSOP II | |
| Base Product Number | W9812G6 | W9812G6 | |
| Rohs Code | Yes | ||
| Part Life Cycle Code | Obsolete | ||
| Part Package Code | BGA | ||
| Pin Count | 54 | ||
| ECCN Code | EAR99 | ||
| HTS Code | 8542.32.00.02 | ||
| Access Mode | FOUR BANK PAGE BURST | ||
| Access Time-Max | 5 ns | ||
| Additional Feature | AUTO/SELF REFRESH | ||
| Clock Frequency-Max (fCLK) | 166 MHz | ||
| I/O Type | COMMON | ||
| Interleaved Burst Length | 1,2,4,8 | ||
| JESD-30 Code | S-PBGA-B54 | ||
| Length | 8 mm | ||
| Memory Density | 134217728 bit | ||
| Memory IC Type | SYNCHRONOUS DRAM | ||
| Memory Width | 16 | ||
| Number of Functions | 1 | ||
| Number of Ports | 1 | ||
| Number of Terminals | 54 | ||
| Number of Words | 8388608 words | ||
| Number of Words Code | 8000000 | ||
| Operating Mode | SYNCHRONOUS | ||
| Operating Temperature-Max | 85 °C | ||
| Operating Temperature-Min | -40 °C | ||
| Organization | 8MX16 | ||
| Output Characteristics | 3-STATE | ||
| Package Body Material | PLASTIC/EPOXY | ||
| Package Code | TFBGA | ||
| Package Equivalence Code | BGA54,9X9,32 | ||
| Package Shape | SQUARE | ||
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | ||
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | ||
| Power Supplies | 3.3 V | ||
| Qualification Status | Not Qualified | ||
| Refresh Cycles | 4096 | ||
| Seated Height-Max | 1.2 mm | ||
| Self Refresh | YES | ||
| Sequential Burst Length | 1,2,4,8,FP | ||
| Standby Current-Max | 0.002 A | ||
| Supply Current-Max | 0.075 mA | ||
| Supply Voltage-Max (Vsup) | 3.6 V | ||
| Supply Voltage-Min (Vsup) | 3 V | ||
| Supply Voltage-Nom (Vsup) | 3.3 V | ||
| Surface Mount | YES | ||
| Temperature Grade | INDUSTRIAL | ||
| Terminal Form | BALL | ||
| Terminal Pitch | 0.8 mm | ||
| Terminal Position | BOTTOM | ||
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | ||
| Width | 8 mm | ||
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | ||
| Package Description | TFBGA, BGA54,9X9,32 | ||
| Samacsys Manufacturer | Winbond |
零件號
關鍵字: W9812
零件號 "W9812" 回傅 20 個結果; 所有結果都匹配且頭部為 "W9812".
| 零件號 | 描述 | 製造商 | 包裝/箱 | 生命週期狀態 | 貨物週期 | 有存貨 | 操作 |
|---|---|---|---|---|---|---|---|
| W9812G6JH-6 |
166MHz 128MB SDRAM IC 54TSOPII |
Winbond Electronics Corp | TSOP54 | 3~7 天 | 5,709.00 | ||
| W9812G6KH-6 |
DRAM 128Mb SDR SDRAM x16, 166MHz |
Winbond Electronics | TSOP-54 | 3~7 天 | 5,616.00 | ||
| W9812G2GH-6 |
Synchronous DRAM, 4MX32, 5ns, CMOS, PDSO86, 0.400 INCH, ROHS COMPLIANT, TSOP2-86 |
WINBOND | TSOP-86 | 3~7 天 | 7,510.00 | ||
| W981208BH-75 |
Synchronous DRAM, 16MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, TSOP2-54 |
WINBOND | TSOP | 3~7 天 | 4,396.00 | ||
| W9812G6XH-6 |
|
WINBOND | TSOP-54 | 3~7 天 | 3,606.00 | ||
| W9812G6KH-5I TR |
Enjoy seamless multitasking with this high-quality SDRAM module |
Winbond Electronics | TSOP-54 | 3~7 天 | 6,484.00 | ||
| W9812G6JB-6 |
Elevate your computing experience with this advanced SDRAM chip |
Winbond Electronics | TFBGA-54 | 3~7 天 | 3,424.00 | ||
| W9812G6JB-6I TR |
W9812G6JB-6I TR SDRAM ROHS with TFBGA-54(8x8) packaging |
Winbond | TFBGA-54 | 3~7 天 | 7,302.00 | ||
| W9812G6KH-5 |
Robust design ensures compatibility with various systems and application |
Winbond | TSOP-54 | 3~7 天 | 4,719.00 | ||
| W9812G6KH-6I TR |
Enhanced data storage and processing capabilities for optimal result |
Winbond | TSOP-54 | 3~7 天 | 6,997.00 | ||
| W9812G6KH-6 TR |
Compact and robust TSOP-II package ensures durability on the roa |
Winbond | TSOP-54 | 3~7 天 | 2,477.00 | ||
| W9812G6KH-5 TR |
*Memory Performance Enhancer**: Boost your system's memory capabilities with this SDRAM chip, offering 128Mbit of storage |
Winbond | TSOP-54 | 3~7 天 | 5,613.00 | ||
| W9812G6JH-6I |
Fast and reliable storage solution for various applications |
Winbond Electronics | 54-TSOP(0.400",10.16mmWidth) | OBSOLETE | 3~7 天 | 7,617.00 | |
| W9812G6JH-5 |
Fast and reliable memory solution for your high-performance needs, MHz clock speed |
Winbond Electronics | 54-TSOP | 3~7 天 | 5,327.00 | ||
| W9812G6GH-75 |
Superior performance and capacity make it an excellent choice for many device |
Winbond Electronics Corp | TSOP54 | 3~7 天 | 5,215.00 | ||
| W9812G6IH-6 |
High-speed synchronous DRAM with fast access times and low power consumption for efficient data transfer and storag |
Winbond Electronics | 54-TSOP(0.400",10.16mmWidth) | OBSOLETE | 3~7 天 | 9,417.00 | |
| W9812G6KB-6I |
Experience lightning-fast data transfer speeds with High-Speed SDRAM's incredible bandwidth capabilities |
Winbond | 54-TFBGA | 3~7 天 | 3,381.00 | ||
| W9812G2KB-6I TR |
Fast-paced performance with b capaci |
Winbond | TFBGA-90 | 3~7 天 | 6,340.00 | ||
| W9812G2KB-6I |
Megabit X Banks SDRAM for Reliable Operati |
Winbond | TFBGA-90 | 3~7 天 | 5,138.00 | ||
| W9812G6KH-6I |
TSOP-54-10.2mm SDRAM ROHS |
Winbond Electronics | TSOP-54 | ACTIVE | 3~7 天 | 7,252.00 |