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產品對比: W631GG6KB-12 vs W631GG6KB vs W631GG6MB-11
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零件號
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| Manufacturer | WINBOND | Winbond | WINBOND |
| Package | FBGA96 | Packaged | 96-VFBGA |
| Description | This is the description for product W631GG6KB-12 from Winbond Electronics Corporation | IC DRAM 1GBIT PARALLEL 96WBGA | 96-pin VFBGA package for easy installation |
| Stock | 6183 | 4442 | 6407 |
| Technology | CMOS | SDRAM - DDR3 | CMOS |
| Rohs Code | Yes | Yes | |
| Part Life Cycle Code | Obsolete | Obsolete | |
| Reach Compliance Code | compliant | compliant | |
| ECCN Code | EAR99 | EAR99 | |
| HTS Code | 8542.32.00.32 | 8542.32.00.32 | |
| Access Mode | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B96 | R-PBGA-B96 | |
| Length | 13 mm | 13 mm | |
| Memory Density | 1073741824 bit | 1073741824 bit | |
| Memory IC Type | DDR3 DRAM | DDR DRAM | |
| Memory Width | 16 | 16 | |
| Number of Functions | 1 | 1 | |
| Number of Ports | 1 | 1 | |
| Number of Terminals | 96 | 96 | |
| Number of Words | 67108864 words | 67108864 words | |
| Number of Words Code | 64000000 | 64000000 | |
| Operating Mode | SYNCHRONOUS | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | 95 °C | |
| Organization | 64MX16 | 64MX16 | |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | |
| Package Code | TFBGA | VFBGA | |
| Package Shape | RECTANGULAR | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | NOT SPECIFIED | |
| Seated Height-Max | 1.2 mm | 1 mm | |
| Self Refresh | YES | YES | |
| Supply Voltage-Max (Vsup) | 1.575 V | 1.575 V | |
| Supply Voltage-Min (Vsup) | 1.425 V | 1.425 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | 1.5 V | |
| Surface Mount | YES | YES | |
| Temperature Grade | OTHER | OTHER | |
| Terminal Form | BALL | BALL | |
| Terminal Pitch | 0.8 mm | 0.8 mm | |
| Terminal Position | BOTTOM | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | NOT SPECIFIED | |
| Width | 9 mm | 7.5 mm | |
| Part Package Code | BGA | ||
| Pin Count | 96 | ||
| Access Time-Max | 0.225 ns | ||
| Clock Frequency-Max (fCLK) | 800 MHz | ||
| I/O Type | COMMON | ||
| Interleaved Burst Length | 8 | ||
| Output Characteristics | 3-STATE | ||
| Package Equivalence Code | BGA96,9X16,32 | ||
| Power Supplies | 1.5 V | ||
| Qualification Status | Not Qualified | ||
| Refresh Cycles | 8192 | ||
| Sequential Burst Length | 8 | ||
| Standby Current-Max | 0.014 A | ||
| Supply Current-Max | 0.4 mA | ||
| Category | Integrated Circuits (ICs)MemoryMemory | ||
| Mfr | Winbond Electronics | ||
| Series | - | ||
| Product Status | Obsolete | ||
| Programmable | Not Verified | ||
| Memory Type | Volatile | ||
| Memory Format | DRAM | ||
| Memory Size | 1Gbit | ||
| Memory Organization | 64M x 16 | ||
| Memory Interface | Parallel | ||
| Clock Frequency | 800 MHz | ||
| Write Cycle Time - Word, Page | - | ||
| Access Time | 20 ns | ||
| Voltage - Supply | 1.425V ~ 1.575V | ||
| Operating Temperature | 0°C ~ 85°C (TC) | ||
| Mounting Type | Surface Mount | ||
| Package / Case | 96-TFBGA | ||
| Supplier Device Package | 96-WBGA (9x13) | ||
| Base Product Number | W631GG6 | ||
| Date Of Intro | 2017-12-01 |
零件號
關鍵字: W631G
零件號 "W631G" 回傅 20 個結果; 所有結果都匹配且頭部為 "W631G".
| 零件號 | 描述 | 製造商 | 包裝/箱 | 生命週期狀態 | 貨物週期 | 有存貨 | 操作 |
|---|---|---|---|---|---|---|---|
| W631GG6KB-15 |
WBGA-96 Memory Module ROHS |
Winbond | WBGA | 3~7 天 | 5,911.00 | ||
| W631GG6KB15K |
Double Data Rate architecture: two data transfers per clock cycle |
WINBOND | BGA | 3~7 天 | 3,595.00 | ||
| W631GG6MB09J |
Super-fast data transfer speeds for intense processing deman |
Winbond Electronics | VFBGA-96 | 3~7 天 | 2,308.00 | ||
| W631GU6NB15J |
Advanced memory technology for improved system responsiveness and efficienc |
Winbond Electronics | VFBGA-96 | 3~7 天 | 3,157.00 | ||
| W631GG8NB15J |
Fast 20 ns access time ensures quick response times |
Winbond Electronics | VFBGA-78 | 3~7 天 | 5,133.00 | ||
| W631GG6NB09J |
High-Speed Memory for Data Centers |
Winbond Electronics | VFBGA-96 | 3~7 天 | 5,711.00 | ||
| W631GG8NB11J |
Fast and reliable memory solution for demanding application |
Winbond Electronics | VFBGA-78 | 3~7 天 | 7,292.00 | ||
| W631GU6NB12J |
High-speed DDR3L memory IC for fast data processing |
Winbond Electronics | VFBGA-96 | 3~7 天 | 2,169.00 | ||
| W631GG8NB12J |
Speedy 800 MHz frequency for efficient data processing |
Winbond Electronics | VFBGA-78 | 3~7 天 | 6,326.00 | ||
| W631GU6NB09J |
High-performance SDRAM module for demanding application |
Winbond Electronics | VFBGA-96 | 3~7 天 | 5,650.00 | ||
| W631GG6NB15J |
Fast data transfer rates and low power consumption guarante |
Winbond Electronics | VFBGA-96 | 3~7 天 | 2,108.00 | ||
| W631GU6NB11J |
Reliable 64M x 16 configuration ensures seamless operation |
Winbond Electronics | VFBGA-96 | 3~7 天 | 2,825.00 | ||
| W631GG6NB11J |
Low-latency, high-speed memory ideal for computing and gaming need |
Winbond Electronics | VFBGA-96 | 3~7 天 | 7,561.00 | ||
| W631GG6NB12J |
Compact 96-VFBGA package for space-saving designs |
Winbond Electronics | VFBGA-96 | 3~7 天 | 7,042.00 | ||
| W631GU6MB09I TR |
Reliable x16 memory module for rugged applications |
Winbond Electronics | VFBGA-96 | 3~7 天 | 7,148.00 | ||
| W631GG6MB11J TR |
Compact 96-VFBGA package for space-saving designs |
Winbond Electronics | VFBGA-96 | 3~7 天 | 4,896.00 | ||
| W631GU6NB09J TR |
Compact -VFBGA Package for Space-Efficient Designs |
Winbond Electronics | VFBGA-96 | 3~7 天 | 4,666.00 | ||
| W631GU6NB12J TR |
High-performance memory solution for demanding computing application |
Winbond Electronics | VFBGA-96 | 3~7 天 | 3,870.00 | ||
| W631GU6MB11J TR |
High-speed DDR SDRAM for reliable computin |
Winbond Electronics | VFBGA-96 | 3~7 天 | 3,263.00 | ||
| W631GG6NB15J TR |
High-performance SDRAM module for demanding applications |
Winbond Electronics | VFBGA-96 | 3~7 天 | 3,286.00 |