產品對比: K4B4G1646D-BCK0 vs K4B4G1646D-BCMA vs K4B4G1646E-BCK0

隱藏相同的屬性

全部
零件號
Manufacturer Samsung Electronics Samsung Electro-Mechanics Samsung Artik
Package FBGA FBGA FBGA
Description DRAM Chip DDR3 SDRAM 4Gbit High-performance computing relies on this modul DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 96-Pin FBGA
Stock 6207 3892 5832
Product Category IC Chips IC Chips
ECCN (US) EAR99
Part Status LTB
HTS 8542.32.00.36
Automotive No
PPAP No
DRAM Type DDR3 SDRAM
Chip Density (bit) 4G
Organization 256Mx16
Number of Internal Banks 8
Number of Words per Bank 32M
Number of Bits/Word (bit) 16
Data Bus Width (bit) 16
Maximum Clock Rate (MHz) 1600
Maximum Access Time (ns) 0.225
Address Bus Width (bit) 18
Interface Type SSTL_1.5
Minimum Operating Supply Voltage (V) 1.425
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 115
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Number of I/O Lines (bit) 16
Mounting Surface Mount
Package Width 7.5
Package Length 13.3
PCB changed 96
Standard Package Name BGA
Supplier Package FBGA
Pin Count 96
Lead Shape Ball
全部

零件號

關鍵字: K4B4G

零件號 "K4B4G" 回傅 20 個結果; 所有結果都匹配且頭部為 "K4B4G".

零件號 描述 製造商 包裝/箱 生命週期狀態 貨物週期 有存貨 操作
K4B4G1646D-BYK0

Key Features: The K4B4G1646D-BYK0 is a high-density memory chip, offering 4Gbit of storage in a compact 96-Pin FBGA form factor

Olimex Ltd FBGA Obsolete 3~7 天 6,798.00
K4B4G0846D-BYK0

High-density memory chip

SAMSUNG FBGA96 3~7 天 3,968.00
K4B4G0846B-HYK0

Low-voltage 1.35V technology

SAMSUNG FBGA 3~7 天 7,622.00
K4B4G1646E-BMMA

Small outline, high-performance RAM module

Samsung FBGA96 3~7 天 7,033.00
K4B4G1646D-BHMA

DDR DRAM module with a capacity of 256 megabytes, using a 16-bit data bus

SAMSUNG BGA 3~7 天 4,478.00
K4B4G0846E-BYMA

High Density Memory Module with 4Gbit Capacity and 1.35V/1.5V Voltage Support

Samsung Artik FBGA 3~7 天 7,456.00
K4B4G0846E-BYK0

Cutting-edge DDR3L DRAM chip, offering a 512MX8 configuration in a compact PBGA78 package, ideal for various memory-intensive applications

Samsung Artik FBGA 3~7 天 5,512.00
K4B4G0846A-HCH9

Samsung FBGA96

SAMSUNG FBGA96 3~7 天 7,960.00
K4B4G1646E-BYK000

High-performance parallel memory for demanding applications

Samsung Electro-Mechanics TFBGA-96 3~7 天 6,788.00
K4B4G1646B-HCK0

Environmentally friendly 96FBGA package

Samsung Electronics FBGA OBSOLETE 3~7 天 9,243.00
K4B4G1646E-BYMA

Reliable and efficient memory chip designed for industrial application

Samsung Artik BGA 3~7 天 6,093.00
K4B4G1646D-BCK0000

Unmatched speed and capacity for demanding application

Samsung Electronics FBGA 3~7 天 3,360.00
K4B4G1646E-BMMA0CV

High-performance DRAM chip for demanding applications requiring massive memory capacity and low power consumptio

Samsung Electronics FBGA ACTIVE 3~7 天 6,578.00
K4B4G1646E-BYMATCV

Fast memory chips

Samsung Electronics FBGA ACTIVE 3~7 天 9,666.00
K4B4G1646D-BYMA000

Enhanced data transfer and processing capabilities

Samsung Electronics FBGA 3~7 天 5,897.00
K4B4G1646E-BMMA000

Compact 96-pin FBGA package for space-saving design

Samsung Electronics FBGA 3~7 天 5,027.00
K4B4G1646E-BCNB0CV

**Memory Expansion**: This product is a DRAM module designed for memory expansion and upgrade purposes

Samsung Electronics FBGA 3~7 天 3,507.00
K4B4G0846E-BYMA000

Optimized for high-performance computing and virtualization

Samsung Electronics FBGA 3~7 天 5,892.00
K4B4G1646D-BCK0T00

Unleash powerful processing with this DDR3 SDRAM chip

Samsung Electronics FBGA 3~7 天 2,434.00
K4B4G1646B-HCMA

DRAM Chip DDR3 SDRAM 4Gbit

Samsung Electronics FBGA OBSOLETE 3~7 天 5,885.00