XPC823ZT66B2
Meet the XPC823ZT66B2, a 32-bit RISC microprocessor that operates at 66MHz and is packaged in PBGA256XPC823ZT66B2
Meet the XPC823ZT66B2, a 32-bit RISC microprocessor that operates at 66MHz and is packaged in PBGA256
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製造商零件號 # : XPC823ZT66B2
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包裝/封裝: BGA-256
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零件狀態 : ACTIVE
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製造商: NXP Semiconductors
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產品分類 : Microprocessors
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RoHS:
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XPC823ZT66B2 數據表
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詳細說明
主要特徵
- The following list summarizes the key MPC860
- features:
- Embedded single-issue, 32-bit MPC8xx core (implementing the PowerPC architecture) with thirty-two 32-bit general-purpose registers (GPRs)
- — The core performs branch prediction with conditional prefetch, without conditional execution
- — 4- or 8-Kbyte data cache and 4- or 16-Kbyte instruction cache (see Table 1)
- – 16-Kbyte instruction caches are four-way, set-associative with 256 sets;
- 4-Kbyte instruction caches are two-way, set-associative with 128 sets.
- – 8-Kbyte data caches are two-way, set-associative with 256 sets; 4-Kbyte data caches are two-way, set-associative with 128 sets.
- – Cache coherency for both instruction and data caches is maintained on 128-bit (4-word) cache blocks.
- – Caches are physically addressed, implement a least recently used (LRU) replacement algorithm, and are lockable on a cache block basis.
- — Instruction and data caches are two-way, set-associative, physically addressed, LRU replacement, and lockable on-line granularity.
- — MMUs with 32-entry TLB, fully associative instruction, and data TLBs
- — MMUs support multiple page sizes of 4, 16, and 512 Kbytes, and 8 Mbytes; 16 virtual address spaces and 16 protection groups
- — Advanced on-chip-emulation debug mode
- Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits)
- 32 address lines
- Operates at up to 80 MHz
- Memory controller (eight banks)
- — Contains complete dynamic RAM (DRAM) controller
- — Each bank can be a chip select or RASto support a DRAM bank
- — Up to 15 wait states programmable per memory bank
- — Glueless interface to DRAM, SIMMS, SRAM, EPROM, Flash EPROM, and other memory devices.
- — DRAM controller programmable to support most size and speed memory interfaces
- — Four CASlines, four WElines, one OEline
- — Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory)
- — Variable block sizes (32 Kbyte to 256 Mbyte)
- — Selectable write protection
- — On-chip bus arbitration logic
- General-purpose timers
- — Four 16-bit timers or two 32-bit timers
- — Gate mode can enable/disable counting
- — Interrupt can be masked on reference match and event capture
- System integration unit (SIU)
- — Bus monitor
- — Software watchdog
- — Periodic interrupt timer (PIT)
- — Low-power stop mode
- — Clock synthesizer
- — Three parallel I/O registers with open-drain capability
- Four baud-rate generators (BRGs)
- — Independent (can be connected to any SCC or SMC)
- — Allow changes during operation
- — Autobaud support option
- Four serial communications controllers (SCCs)
- — Ethernet/IEEE 802.3 optional on SCC1–4, supporting full 10-Mbps operation (available only on specially programmed devices).
- — HDLC/SDLC(all channels supported at 2 Mbps)
- — HDLC bus (implements an HDLC-based local area network (LAN))
- — Asynchronous HDLC to support PPP (point-to-point protocol)
- — AppleTalk
- — Universal asynchronous receiver transmitter (UART)
- — Synchronous UART
- — Serial infrared (IrDA)
- — Binary synchronous communication (BISYNC)
- — Totally transparent (bit streams)
- — Totally transparent (frame based with optional cyclic redundancy check (CRC))
- Two SMCs (serial management channels)
- — UART
- — Transparent
- — General circuit interface (GCI) controller
- — Can be connected to the time-division multiplexed (TDM) channels
- One SPI (serial peripheral interface)
- — Supports master and slave modes
- — Supports multimaster operation on the same bus
- One I2C (inter-integrated circuit) port
- — Supports master and slave modes
- — Multiple-master environment support
- Time-slot assigner (TSA)
- — Allows SCCs and SMCs to run in multiplexed and/or non-multiplexed operation
- — Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user defined
- — 1- or 8-bit resolution
- — Allows independent transmit and receive routing, frame synchronization, clocking
- — Allows dynamic changes
- — Can be internally connected to six serial channels (four SCCs and two SMCs)
- Parallel interface port (PIP)
- — Centronics interface support
- — Supports fast connection between compatible ports on the MPC860 or the MC68360
- PCMCIA interface
- — Master (socket) interface, release 2.1 compliant
- — Supports two independent PCMCIA sockets
- — Eight memory or I/O windows supported
- Low power support
- — Full on—all units fully powered
- — Doze—core functional units disabled, except time base decrementer, PLL, memory controller, RTC, and CPM in low-power standby
- — Sleep—all units disabled, except RTC and PIT, PLL active for fast wake up
- — Deep sleep—all units disabled including PLL, except RTC and PIT
- — Power down mode— all units powered down, except PLL, RTC, PIT, time base, and decrementer
- Debug interface
- — Eight comparators: four operate on instruction address, two operate on data address, and two operate on data
- — Supports conditions: =≠<>
- — Each watchpoint can generate a break-point internally
- 3.3 V operation with 5-V TTL compatibility except EXTAL and EXTCLK
- 357-pin ball grid array (BGA) package
規格
以下是所選零件的基本參數,涉及零件的特性及其所屬類別。
Part Life Cycle Code | Transferred | Ihs Manufacturer | MOTOROLA INC |
Package Description | BGA, BGA256,16X16,50 | Reach Compliance Code | |
HTS Code ! | 8542.31.00.01 | Bit Size | 32 |
JESD-30 Code | S-PBGA-B256 | Number of Terminals | 256 |
Operating Temperature-Max | 70 °C | Operating Temperature-Min | |
Package Body Material | PLASTIC/EPOXY | Package Code | BGA |
Package Equivalence Code | BGA256,16X16,50 | Package Shape | SQUARE |
Package Style | GRID ARRAY | Power Supplies ! | 3.3 V |
Qualification Status ! | Not Qualified | Speed | 66 MHz |
Supply Voltage-Nom | 3.3 V | Surface Mount ! | YES |
Temperature Grade ! | COMMERCIAL | Terminal Form ! | BALL |
Terminal Pitch ! | 1.27 mm | Terminal Position | BOTTOM |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
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