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THGBMJG9C8LBAU8
e-MMC TLC NAND Flash Serial 3.3V 512G-bit 153-Pin FBGA
THGBMJG9C8LBAU8
e-MMC TLC NAND Flash Serial 3.3V 512G-bit 153-Pin FBGA
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THGBMJG9C8LBAU8 數據表
目前的價格方案正在編制中。請聯絡我們的客戶服務團隊獲取最新的價格資訊。感謝您的理解和支援!
詳細說明
The THGBMJG9C8LBAU8 is a high-quality electronic component classified as an IC Flash 512Gbit eMMC in a 153-ball fine pitch BGA package. This component is commonly used in various electronic devices such as smartphones, tablets, laptops, and other portable consumer electronics. The THGBMJG9C8LBAU8 offers a massive storage capacity of 512 gigabits, allowing for ample space to store data, multimedia files, and applications. The eMMC interface of this component enables seamless data transfer and read/write operations, making it ideal for high-performance devices that require fast access to data. With its small 153-ball fine pitch BGA package, the THGBMJG9C8LBAU8 is compact and space-saving, making it suitable for use in compact and lightweight electronic devices. The component is also designed to operate efficiently and reliably, ensuring stable performance even in demanding applications.
主要特徵
- 64GB capacity
- Low-power DDR4 SDRAM technology
- Supports LPDDR4X interface
- 1.8V power supply
- Available in 14x18mm package size
- Operational temperature range of -25°C to 85°C
- Compatible with various applications like smartphones, tablets, and automotive systems
應用
- Smartphones
- Tablets
- Ultrabooks
- Internet of Things (IoT) devices
- Automotive applications
- Medical devices
- Industrial equipment
- Networking equipment
- Gaming devices
- Wearable technology
規格
以下是所選零件的基本參數，涉及零件的特性及其所屬類別。
| Part Life Cycle Code | Active | Reach Compliance Code | |
| ECCN Code | EAR99 | HTS Code ! | 8542.32.00.51 |
| Date Of Intro | 2019-10-02 | Clock Frequency-Max (fCLK) | 52 MHz |
| JESD-30 Code | R-PBGA-B153 | Length | 13 mm |
| Memory Density | 549755813888 bit | Memory IC Type | FLASH CARD |
| Memory Width | 8 | Number of Functions | 1 |
| Number of Terminals | 153 | Number of Words | 68719476736 words |
| Number of Words Code | 64000000000 | Operating Mode ! | SYNCHRONOUS |
| Operating Temperature-Max | 105 °C | Operating Temperature-Min | -40 °C |
| Organization | 64GX8 | Package Body Material | PLASTIC/EPOXY |
| Package Code | TFBGA | Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Parallel/Serial | PARALLEL |
| Programming Voltage ! | 2.7 V | Seated Height-Max | 1.2 mm |
| Supply Voltage-Max (Vsup) | 3.6 V | Supply Voltage-Min (Vsup) | 2.7 V |
| Supply Voltage-Nom (Vsup) | 3.3 V | Surface Mount ! | YES |
| Technology | CMOS | Temperature Grade ! | INDUSTRIAL |
| Terminal Form ! | BALL | Terminal Pitch ! | 0.5 mm |
| Terminal Position | BOTTOM | Width | 11.5 mm |
數據表 PDF
數據表記錄了器件的特性、絕對最大額定值、應用等，這對於作為器件特定應用的整體指南大有裨益。
常見問題解答
What is THGBMJG9C8LBAU8?
The THGBMJG9C8LBAU8 is a NAND flash memory module manufactured by Toshiba. It is commonly used in a variety of electronic devices such as smartphones, tablets, and digital cameras for storing data and programs.
How Does THGBMJG9C8LBAU8 Work?
The THGBMJG9C8LBAU8 works by storing data in a non-volatile memory array composed of multiple NAND flash memory cells. It utilizes a controller to manage data read and write operations, wear leveling, error correction, and bad block management. The NAND flash memory allows for high-speed data access and reliable storage of information.
How Many Pins does THGBMJG9C8LBAU8 have and What are the Functions of the Pinout Configuration?
The THGBMJG9C8LBAU8 typically comes in a BGA (Ball Grid Array) package with multiple pins for various functions. The pinout configuration includes power supply pins, data input/output pins, control pins for communication with the host device, and other pins for internal memory management operations.
What are the Pros and Cons of THGBMJG9C8LBAU8?
Pros:
- High Storage Capacity: Offers a large storage capacity for data-intensive applications.
- Fast Data Access: Provides high-speed read and write operations for efficient data transfer.
- Reliability: Features built-in error correction and wear leveling algorithms for data integrity.
- Compact Form Factor: BGA packaging allows for a small footprint, ideal for space-constrained designs.
Cons:
- Endurance Limit: NAND flash memory has a limited number of program/erase cycles, affecting longevity in heavy usage scenarios.
- Complexity: Requires a controller to manage memory operations, adding complexity to the system design.
Are There Any Equivalents/Alternatives to THGBMJG9C8LBAU8 for Recommendation?
Alternatives to the THGBMJG9C8LBAU8 include similar NAND flash memory modules from manufacturers like Samsung, Micron, and SK Hynix. Some equivalents may offer different features or specifications based on the application requirements.
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