TE28F800C3TA90
Flash, 512KX16, 90ns, PDSO48
品質保證
品質保證
從我們的供應鍊網路採購的所有零件都經過嚴格的進貨檢驗流程。 這種細緻的檢查可確保客戶收到的零件是正品並符合要求的標準。 此外,我們還保存這些檢查的詳細記錄,以確保整個供應鏈的透明度和可追溯性。
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認證
我們已成功獲得各項認證標準,並建立了自己的專業檢測實驗室。 這確保了我們向客戶提供的每件產品都符合最高的品質標準。 我們遵守嚴格的測試協議,以保持我們產品的一致性和準確性。 為了確保我們的產品是原裝正品,我們還與信譽良好的第三方檢測機構合作進行嚴格的品質測試。 我們對品質的承諾延伸到滿足行業、法律、監管和 ISO 9001:2015 的要求。
運輸與付款
運輸與付款
關於運送
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關於付款
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信用卡
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西聯匯款
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速匯金
服務與包裝
服務與包裝
About After Sales Service
All Parts Extended Quality Guarantee
自發貨之日起 90 天內發起申請。
與我們的工作人員確認退貨或換貨。
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關於包裝
在包裝方面,我們的產品均精心包裝在防靜電袋中,以提供ESD防靜電保護。 外包裝堅固耐用且閉合牢固。 我們支持各種包裝方法,例如捲帶式、切帶式、管式或託盤式。
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例子
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捲帶式
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剪膠帶
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管或託盤
TE28F800C3TA90 數據表
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目前的價格方案正在編制中。請聯絡我們的客戶服務團隊獲取最新的價格資訊。感謝您的理解和支援!
詳細說明
Device DescriptionThis section provides an overview of the Intel® Advanced+ Boot Block Flash Memory (C3) device features, packaging, signal naming, and device architecture.Product OverviewThe C3 device provides high-performance asynchronous reads in package-compatible densities with a 16 bit data bus. Individually-erasable memory blocks are optimally sized for code and data storage. Eight 4 Kword parameter blocks are located in the boot block at either the top or bottom of the device’s memory map. The rest of the memory array is grouped into 32 Kword main blocks.Product Features■ Flexible SmartVoltage Technology —2.7 V– 3.6 V Read/Program/Erase —12 V for Fast Production Programming■ 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option —Reduces Overall System Power■ High Performance —2.7 V– 3.6 V: 70 ns Max Access Time■ Optimized Architecture for Code Plus Data Storage —Eight 4 Kword Blocks, Top or Bottom Parameter Boot —Up to One Hundred-Twenty-Seven 32 Kword Blocks —Fast Program Suspend Capability —Fast Erase Suspend Capability■ Flexible Block Locking —Lock/Unlock Any Block —Full Protection on Power-Up —WP# Pin for Hardware Block Protection■ Low Power Consumption —9 mA Typical Read —7 A Typical Standby with Automatic Power Savings Feature (APS)■ Extended Temperature Operation —–40 °C to +85 °C■ 128-bit Protection Register —64 bit Unique Device Identifier —64 bit User Programmable OTP Cells■ Extended Cycling Capability —Minimum 100,000 Block Erase Cycles■ Software —Intel® Flash Data Integrator (FDI) —Supports Top or Bottom Boot Storage, Streaming Data (e.g., voice) —Intel Basic Command Set —Common Flash Interface (CFI)■ Standard Surface Mount Packaging —48-Ball µBGA*/VFBGA —64-Ball Easy BGA Packages —48-Lead TSOP Package■ ETOX™ VIII (0.13 µm) Flash Technology —16, 32 Mbit■ ETOX™ VII (0.18 µm) Flash Technology —16, 32, 64 Mbit■ ETOX™ VI (0.25 µm) Flash Technology —8, 16 and 32 Mbit
主要特徵
- Flexible SmartVoltage Technology
- —2.7 V– 3.6 V Read/Program/Erase
- —12 V for Fast Production Programming
- 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option
- —Reduces Overall System Power
- High Performance
- —2.7 V– 3.6 V: 70 ns Max Access Time
- Optimized Architecture for Code Plus Data Storage
- —Eight 4 Kword Blocks, Top or Bottom Parameter Boot
- —Up to One Hundred-Twenty-Seven 32 Kword Blocks
- —Fast Program Suspend Capability
- —Fast Erase Suspend Capability
- Flexible Block Locking
- —Lock/Unlock Any Block
- —Full Protection on Power-Up
- —WP# Pin for Hardware Block Protection
- Low Power Consumption
- —9 mA Typical Read
- —7 A Typical Standby with Automatic Power Savings Feature (APS)
- Extended Temperature Operation
- —–40 °C to +85 °C
- 128-bit Protection Register
- —64 bit Unique Device Identifier
- —64 bit User Programmable OTP Cells
- Extended Cycling Capability
- —Minimum 100,000 Block Erase Cycles
- Software
- —Intel® Flash Data Integrator (FDI)
- —Supports Top or Bottom Boot Storage, Streaming Data (e.g., voice)
- —Intel Basic Command Set
- —Common Flash Interface (CFI)
- Standard Surface Mount Packaging
- —48-Ball µBGA/VFBGA
- —64-Ball Easy BGA Packages
- —48-Lead TSOP Package
- ETOX™ VIII (0.13 µm) Flash Technology
- —16, 32 Mbit
- ETOX™ VII (0.18 µm) Flash Technology
- —16, 32, 64 Mbit
- ETOX™ VI (0.25 µm) Flash Technology
- —8, 16 and 32 Mbit
規格
以下是所選零件的基本參數,涉及零件的特性及其所屬類別。
Rohs Code | No | Part Life Cycle Code | Obsolete |
Reach Compliance Code | ECCN Code | EAR99 | |
HTS Code ! | 8542.32.00.51 | Access Time-Max | 90 ns |
Boot Block | TOP | Command User Interface | YES |
Common Flash Interface | YES | Data Polling | NO |
JESD-30 Code | R-PDSO-G48 | Length | 18.4 mm |
Memory Density | 8388608 bit | Memory IC Type | FLASH |
Memory Width | 16 | Number of Sectors/Size | 8,15 |
Number of Terminals | 48 | Number of Words | 524288 words |
Number of Words Code | 512000 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 512KX16 |
Package Body Material | PLASTIC/EPOXY | Package Code | TSSOP |
Package Equivalence Code | TSSOP48,.8,20 | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Parallel/Serial | PARALLEL |
Power Supplies ! | 1.8/3.3,3/3.3 V | Programming Voltage ! | 3 V |
Qualification Status ! | Not Qualified | Seated Height-Max | 1.2 mm |
Sector Size | 4K,32K | Standby Current-Max | 0.000025 A |
Supply Current-Max | 0.018 mA | Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 2.7 V | Supply Voltage-Nom (Vsup) | 3 V |
Surface Mount ! | YES | Technology | CMOS |
Temperature Grade ! | INDUSTRIAL | Terminal Form ! | GULL WING |
Terminal Pitch ! | 0.5 mm | Terminal Position | DUAL |
Toggle Bit | NO | Type | NOR TYPE |
Width | 12 mm |
數據表 PDF
數據表記錄了器件的特性、絕對最大額定值、應用等,這對於作為器件特定應用的整體指南大有裨益。
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