SPC5777CK3MME3
High-performance processing chip
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服務與包裝
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SPC5777CK3MME3 數據表
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目前的價格方案正在編制中。請聯絡我們的客戶服務團隊獲取最新的價格資訊。感謝您的理解和支援!
詳細說明
SPC5777CK3MME3 is a high-performance electronic component categorized as an e200z7 MPC57xx Microcontroller IC. It features a 32-bit tri-core architecture with a clock speed of 264MHz, making it suitable for demanding applications that require fast processing capabilities. The microcontroller also includes 8MB of flash memory (8M x 8), providing ample storage space for program code and data. Additionally, the SPC5777CK3MME3 is housed in a 416-MAPBGA package measuring 27x27mm, offering a compact form factor that is ideal for space-constrained designs. This package type also provides good thermal performance, ensuring reliable operation even in high-temperature environments. With its advanced features and robust design, the SPC5777CK3MME3 is well-suited for a wide range of applications, including automotive, industrial control, and networking systems. Its tri-core architecture enables parallel processing, enhancing overall system performance and responsiveness. The microcontroller's high clock speed and ample flash memory make it suitable for real-time applications that require fast data processing and storage capabilities.
主要特徵
- High-performance 32-bit Power Architecture® e200z7 Dual-Core with 300MHz
- 2MB on-chip flash memory and 64KB on-chip data SRAM
- Integrated safety mechanisms for ASIL D compliance
- Multi-core lock-step (MCLSP) architecture for fault tolerance
- Designed for automotive applications requiring high processing power and safety features
應用
- Automotive industry for engine control units
- Industrial control systems for factories and warehouses
- Medical devices for patient monitoring and diagnostics
- Aerospace industry for flight control systems
- Railway systems for signaling and communication
- Telecommunications industry for networking equipment
- Consumer electronics for smart devices and appliances
- Renewable energy systems for power generation and monitoring
- Defense sector for military communication and navigation systems
- Robotics industry for autonomous vehicles and industrial robots
規格
以下是所選零件的基本參數,涉及零件的特性及其所屬類別。
Rohs Code | Yes | Part Life Cycle Code | Active |
Reach Compliance Code | compliant | ECCN Code | 5A992.C |
HTS Code ! | 8542.31.00.01 | Factory Lead Time | 52 Weeks |
Date Of Intro | 2016-03-08 | Has ADC | YES |
Additional Feature ! | ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE. | Address Bus Width ! | |
Bit Size | 32 | Boundary Scan | YES |
CPU Family | E200Z7 | Clock Frequency-Max | 40 MHz |
DAC Channels | NO | DMA Channels | YES |
External Data Bus Width | Format | FLOATING-POINT | |
Integrated Cache | YES | JESD-30 Code | S-PBGA-B416 |
JESD-609 Code | e2 | Length | 27 mm |
Low Power Mode | YES | Moisture Sensitivity Level | 3 |
Number of DMA Channels | 128 | Number of External Interrupts | 1 |
Number of Serial I/Os | 5 | Number of Terminals | 416 |
Number of Timers | On Chip Data RAM Width | 8 | |
On Chip Program ROM Width | 8 | Operating Temperature-Max | 125 °C |
Operating Temperature-Min | -40 °C | PWM Channels | YES |
Package Body Material | PLASTIC/EPOXY | Package Code | BGA |
Package Equivalence Code | BGA416,26X26,40 | Package Shape | SQUARE |
Package Style | GRID ARRAY | Peak Reflow Temperature (Cel) | 260 |
RAM (bytes) | 524288 | ROM (words) | 8388608 |
ROM Programmability | FLASH | Seated Height-Max | 2.02 mm |
Speed | 264 MHz | Supply Current-Max | 1350 mA |
Supply Voltage-Max | 1.32 V | Supply Voltage-Min | 1.2 V |
Surface Mount ! | YES | Technology | CMOS |
Temperature Grade ! | AUTOMOTIVE | Terminal Finish | TIN SILVER |
Terminal Form ! | BALL | Terminal Pitch ! | 1 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 40 |
Width | 27 mm | uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
數據表 PDF
數據表記錄了器件的特性、絕對最大額定值、應用等,這對於作為器件特定應用的整體指南大有裨益。
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