OMAPL138EZWTD4

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SOC OMAPL1xx ARM926EJ-S 361-Pin NFBGA Tray

  • 製造商零件號 # : OMAPL138EZWTD4

  • 包裝/封裝: NFBGA-361

  • 製造商: Texas Instruments

  • 產品分類 : Microprocessors

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OMAPL138EZWTD4 數據表

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詳細說明

The OMAP-L138 EZDSP development kit is a game-changer in the world of development platforms, offering a winning combination of ARM926EJ-S core and C674x DSP. Its integrated USB, Ethernet, and LCD controller peripherals make connectivity effortless, while the inclusion of 32MB of DDR2 SDRAM, 8MB of flash memory, and expansion connectors ensures that your project has room to grow. Complete with a software development kit featuring optimized DSP libraries and support for multiple operating systems, this kit is a versatile and powerful tool for developers of all levels

主要特徵

  • Fully programmable with C674x DSP core
  • ARM Cortex-A8 processor with advanced power management
  • Supports external memory interface for data storage

規格

以下是所選零件的基本參數,涉及零件的特性及其所屬類別。

Arm CPU 1 Arm9 Arm (max) (MHz) 456
Coprocessors C674x DSP CPU 32-bit
Display type 1 LCD Protocols Ethernet
Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS
Operating system Linux, RTOS Security Device identity, Memory protection, Secure boot
Rating Catalog Power supply solution TPS65910
Operating temperature range (°C) -40 to 105, -40 to 90, 0 to 90

常見問題解答

What is OMAPL138EZWTD4?

The OMAPL138EZWTD4 is a system-on-chip (SoC) solution developed by Texas Instruments. It features an ARM9 processor core and a C674x digital signal processor (DSP), making it suitable for applications requiring both microcontroller and DSP functionality, such as industrial automation, medical devices, and audio processing.

How Does OMAPL138EZWTD4 Work?

The OMAPL138EZWTD4 SoC integrates an ARM9 core for general-purpose processing tasks and a C674x DSP for digital signal processing. It provides a unified platform for handling both control and signal processing functions, offering flexibility and performance for various embedded applications. The SoC includes peripherals such as timers, interfaces, and communication ports for system integration.

How Many Pins does OMAPL138EZWTD4 have and What are the Functions of the Pinout Configuration?

The OMAPL138EZWTD4 is housed in a 324-pin BGA (Ball Grid Array) package. The pinout configuration includes a wide range of pins for power, ground, interfaces, memory, and communication, enabling connectivity and functionality for embedded system design.

What are the Pros and Cons of OMAPL138EZWTD4?

Pros:

  • Dual-Core Processing: Combines an ARM9 core and a C674x DSP for versatile computing capabilities.
  • Rich Peripheral Set: Offers a variety of integrated peripherals for system expansion and connectivity.
  • Flexible Configuration: Supports multiple interfaces and communication protocols, enabling diverse application possibilities.
  • Integrated Memory Controller: Includes a memory controller for interfacing with external memory devices.

Cons:

  • Complex Development: Designing applications for dual-core systems may require additional development effort and expertise.
  • Power Consumption: Dual-core systems may consume more power compared to single-core solutions, requiring careful power management.

Are There Any Equivalents/Alternatives to OMAPL138EZWTD4 for Recommendation?

  • The OMAPL137 from Texas Instruments is a similar SoC solution with a different set of integrated peripherals.
  • Alternatives to the OMAPL138EZWTD4 include the i.MX6 series from NXP and the AM335x series from Texas Instruments.

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