MT40A2G4SA-075:E

Name: MT40A2G4SA-075:E
Rating: 4.5 (10 reviews)

Designed for high performance and efficiency, the MT40A2G4SA-075:E chip is ideal for various memory-intensive applications

9,429 有效庫存

MT40A2G4SA-075:E

有效庫存9,429

Designed for high performance and efficiency, the MT40A2G4SA-075:E chip is ideal for various memory-intensive applications

製造商零件號 # : MT40A2G4SA-075:E
包裝/封裝: FBGA-78
零件狀態 : Last Time Buy
製造商: MICRON TECHNOLOGY INC
產品分類 : Memory
RoHS:

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例子

捲帶式

剪膠帶

管或託盤

MT40A2G4SA-075:E 數據表

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詳細說明

The MT40A2G4SA-075:E is an integrated circuit dynamic random-access memory (DRAM) component with a capacity of 8 gigabits. It belongs to the 78-ball fine pitch ball grid array (FBGA) package type, which is a popular choice for high-density memory applications due to its compact size and efficient thermal performance. This particular DRAM component is designed for parallel memory operations, making it suitable for use in a wide range of electronic devices such as computers, servers, networking equipment, and industrial applications. Its high capacity allows for efficient storage and retrieval of data, making it ideal for memory-intensive tasks like data processing, multitasking, and running complex applications. The MT40A2G4SA-075:E offers high-speed performance with a data transfer rate of up to 1.6 Gbps, ensuring quick and seamless access to stored data. It operates at a supply voltage of 1.2V, which helps in conserving power and reducing energy consumption in active and standby modes.

主要特徵

2Gb SDRAM capacity
75ns access time
PC3200 Bus protocol
Industrial temperature range
RoHS compliance
DDR SDRAM type
Lead-free package

應用

Automotive industry - used in car entertainment systems, GPS navigation devices, and driver assistance systems
Industrial automation - used in factory automation, robotics, and control systems
Medical equipment - used in diagnostic imaging devices, patient monitoring systems, and medical instruments
Telecommunications - used in networking equipment, switches, and routers
Consumer electronics - used in smartphones, tablets, and wearable devices
Energy management - used in smart meters and energy monitoring systems
Security systems - used in surveillance cameras and access control systems

規格

以下是所選零件的基本參數，涉及零件的特性及其所屬類別。

Part Life Cycle Code	End Of Life	Ihs Manufacturer	MICRON TECHNOLOGY INC
Package Description	TFBGA,	Reach Compliance Code	compliant
ECCN Code	EAR99	HTS Code !	8542.32.00.36
Factory Lead Time	53 Weeks, 1 Day	Date Of Intro	2017-07-13
Samacsys Manufacturer	Micron	Access Mode !	MULTI BANK PAGE BURST
Additional Feature !	AUTO/SELF REFRESH	I/O Type	COMMON
Interleaved Burst Length	8	JESD-30 Code	R-PBGA-B78
JESD-609 Code	e1	Length	11 mm
Memory Density	8589934592 bit	Memory IC Type	DDR4 DRAM
Memory Width	4	Number of Functions	1
Number of Ports !	1	Number of Terminals	78
Number of Words	2147483648 words	Number of Words Code	2000000000
Operating Mode !	SYNCHRONOUS	Operating Temperature-Max	95 °C
Operating Temperature-Min		Organization	2GX4
Package Body Material	PLASTIC/EPOXY	Package Code	TFBGA
Package Equivalence Code	BGA78,6X13,32	Package Shape	RECTANGULAR
Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH	Peak Reflow Temperature (Cel)	260
Refresh Cycles	65536	Reverse Pinout	NO
Seated Height-Max	1.2 mm	Self Refresh	YES
Supply Voltage-Max (Vsup)	1.26 V	Supply Voltage-Min (Vsup)	1.14 V
Supply Voltage-Nom (Vsup)	1.2 V	Surface Mount !	YES
Technology	CMOS	Temperature Grade !	OTHER
Terminal Finish	TIN SILVER COPPER	Terminal Form !	BALL
Terminal Pitch !	0.8 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	Width	7.5 mm