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MPC562MZP66
With advanced features and powerful processing capabilities, this MCU is ideal for demanding tasks
MPC562MZP66
With advanced features and powerful processing capabilities, this MCU is ideal for demanding tasks
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MPC562MZP66 數據表
目前的價格方案正在編制中。請聯絡我們的客戶服務團隊獲取最新的價格資訊。感謝您的理解和支援!
詳細說明
The MPC562MZP66 is a 32-bit ROMless microcontroller unit (MCU) manufactured by NXP Semiconductors. It belongs to the PowerQUICC II family and is housed in a 388-pin plastic ball grid array (PBGA) package. This MCU is designed for a wide range of applications in areas such as automotive, industrial, and consumer electronics. Key features of the MPC562MZP66 include a high-performance Power Architecture core running at up to 66 MHz, integrated peripherals for enhanced connectivity and functionality, and various power management options for efficient power consumption. It also offers a comprehensive set of timers, communication interfaces, and analog-to-digital converters, making it suitable for demanding real-time applications. Furthermore, the MPC562MZP66 supports various communication protocols such as CAN, LIN, and Ethernet, enabling seamless integration into existing networks. It also includes on-chip debugging capabilities for easier development and testing of applications. In conclusion, the MPC562MZP66 is a versatile and high-performance MCU that offers a robust set of features and capabilities, making it suitable for a wide range of embedded system applications that require a reliable and efficient processing solution
主要特徵
- High-performance 32-bit Power Architecture
- 66MHz core frequency
- Integrated floating point unit
- 3-channel Direct Memory Access (DMA) controller
- 16Kbytes each of data and instruction caches
- Multiple communication interfaces including CAN and SPI
- On-chip watchdog timer and real-time clock
應用
- Automotive industry for engine control units
- Industrial control systems for precision motion control
- Rail transportation for train control systems
- Aerospace industry for flight control systems
- Robotics for high-performance motion control
- Energy management for renewable energy systems
- Medical devices for accurate control of medical equipment
- Smart grid for monitoring and controlling power distribution
規格
以下是所選零件的基本參數，涉及零件的特性及其所屬類別。
| Rohs Code | No | Part Life Cycle Code | Obsolete |
| Part Package Code | BGA | Pin Count ! | 388 |
| Reach Compliance Code | not_compliant | ECCN Code | 3A991 |
| HTS Code ! | 8542.31.00.01 | Has ADC | NO |
| Address Bus Width ! | 24 | Bit Size | 32 |
| Clock Frequency-Max | 20 MHz | DAC Channels | NO |
| DMA Channels | NO | External Data Bus Width | 32 |
| JESD-30 Code | S-PBGA-B388 | JESD-609 Code | e0 |
| Length | 27 mm | Moisture Sensitivity Level | 3 |
| Number of I/O Lines | 16 | Number of Terminals | 388 |
| Operating Temperature-Max | 125 °C | Operating Temperature-Min | -40 °C |
| PWM Channels | NO | Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA | Package Equivalence Code | BGA388,26X26,40 |
| Package Shape | SQUARE | Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 240 | Power Supplies ! | 2.6,5 V |
| Qualification Status ! | Not Qualified | RAM (bytes) | 32768 |
| Seated Height-Max | 2.55 mm | Speed | 66 MHz |
| Supply Voltage-Max | 2.7 V | Supply Voltage-Min | 2.5 V |
| Supply Voltage-Nom | 2.6 V | Surface Mount ! | YES |
| Technology | CMOS | Temperature Grade ! | AUTOMOTIVE |
| Terminal Finish | Tin/Lead/Silver (Sn62Pb36Ag2) | Terminal Form ! | BALL |
| Terminal Pitch ! | 1 mm | Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 | Width | 27 mm |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
數據表 PDF
數據表記錄了器件的特性、絕對最大額定值、應用等，這對於作為器件特定應用的整體指南大有裨益。
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