M430F413

有效庫存4,694

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運輸與付款

運輸與付款

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服務與包裝

服務與包裝

About After Sales Service

All Parts Extended Quality Guarantee

自發貨之日起 90 天內發起申請。

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例子

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M430F413 數據表

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目前的價格方案正在編制中。請聯絡我們的客戶服務團隊獲取最新的價格資訊。感謝您的理解和支援!

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詳細說明

[CREE]PRODUCT DESCRIPTIONThe XLamp® CXA1512 LED array expands Cree’s family of high‑flux, multi‑die arrays in a smaller, easy‑to‑use platform. With XLamp LED lighting‑class reliability, the CXA1512’s small, uniform emitting surface enables both directional and non‑directional lighting applications including lamp retrofit and luminaire designs. Available in 2‑step, 3‑step and 4‑step color consistency, and featuring a 9‑mm optical source, the CXA1512 brings new levels of flux and efficacy to this form factor.FEATURES• Available in 4‑step, 3‑step and 2‑step EasyWhite® bins at 2700 K, 3000 K, 3500 K, 4000 K & 5000 K CCT and 4‑step EasyWhite bins at 5700 K & 6500 K CCT• Available in ANSI white bins at 4000 K, 5000 K, 5700 K & 6500 K CCT• Available in 70‑, 80‑, 90‑ and 93‑minimum CRI options• Forward voltage options: 18‑V class & 36‑V class• 85 °C binning and characterization• Maximum drive current: 1200 mA (18 V), 600 mA (36 V)• 115° viewing angle, uniform chromaticity profile• Top‑side solder connections• Thermocouple attach point• NEMA SSL‑3 2011 standard flux bins• RoHS and REACh compliant• UL® recognized component (E349212)

主要特徵

  • Available in 4‑step, 3‑step and 2‑step EasyWhite® bins at 2700 K, 3000 K, 3500 K, 4000 K & 5000 K CCT and 4‑step EasyWhite bins at 5700 K & 6500 K CCT
  • Available in ANSI white bins at 4000 K, 5000 K, 5700 K & 6500 K CCT
  • Available in 70‑, 80‑, 90‑ and 93‑minimum CRI options
  • Forward voltage options: 18‑V class & 36‑V class
  • 85 °C binning and characterization
  • Maximum drive current: 1200 mA (18 V), 600 mA (36 V)
  • 115° viewing angle, uniform chromaticity profile
  • Top‑side solder connections
  • Thermocouple attach point
  • NEMA SSL‑3 2011 standard flux bins
  • RoHS and REACh compliant
  • UL® recognized component (E349212)

規格

以下是所選零件的基本參數,涉及零件的特性及其所屬類別。

Manufacturer Texas Instruments Product Category ! IC Chips

常見問題解答

What is M430F413?

The M430F413 is a microcontroller unit (MCU) from the MSP430 family designed by Texas Instruments. It is a low-power, high-performance MCU featuring a 16-bit RISC architecture, making it suitable for a wide range of embedded applications.

How Does M430F413 Work?

The M430F413 operates as a microcontroller executing program instructions stored in its memory. It integrates various peripherals such as timers, communication interfaces, and analog-to-digital converters to interact with the external environment. The MCU's low-power design allows for efficient operation in battery-powered devices.

How Many Pins does M430F413 have and What are the Functions of the Pinout Configuration?

The M430F413 is available in different package options with varying pin configurations. The pinout configuration typically includes power supply pins, ground pins, GPIO (General-Purpose Input/Output) pins, communication pins, and other peripheral pins depending on the specific package variant.

What are the Pros and Cons of M430F413?

Pros:

  • Low Power Consumption: Ideal for battery-operated devices and energy-efficient applications.
  • High Performance: Features a 16-bit RISC architecture for efficient processing.
  • Integrated Peripherals: Includes various peripherals for versatile application support.
  • Flexible Memory Options: Offers different memory configurations for program and data storage.

Cons:

  • Limited Processing Power: May not be suitable for complex computational tasks.
  • Peripheral Limitations: The number and types of integrated peripherals may be limited compared to higher-end MCUs.
  • Development Complexity: Requires understanding of low-power design and specific MCU architecture for effective development.

Are There Any Equivalents/Alternatives to M430F413 for Recommendation?

Some alternatives to the M430F413 MCU include the STM32 series from STMicroelectronics and the PIC16 series from Microchip Technology. These offer a range of features and performance capabilities to suit different embedded system requirements.

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