H26M31001HPR

Name: H26M31001HPR
Rating: 4.5 (10 reviews)

Compact and reliable memory for embedded systems

6,433 有效庫存

H26M31001HPR

有效庫存6,433

Compact and reliable memory for embedded systems

製造商零件號 # : H26M31001HPR
製造商: Hynix
產品分類 : Memory

品質保證

從我們的供應鍊網路採購的所有零件都經過嚴格的進貨檢驗流程。這種細緻的檢查可確保客戶收到的零件是正品並符合要求的標準。此外，我們還保存這些檢查的詳細記錄，以確保整個供應鏈的透明度和可追溯性。

認證

我們已成功獲得各項認證標準，並建立了自己的專業檢測實驗室。這確保了我們向客戶提供的每件產品都符合最高的品質標準。我們遵守嚴格的測試協議，以保持我們產品的一致性和準確性。為了確保我們的產品是原裝正品，我們還與信譽良好的第三方檢測機構合作進行嚴格的品質測試。我們對品質的承諾延伸到滿足行業、法律、監管和 ISO 9001:2015 的要求。

運輸與付款

關於運送

我們通常會在幾個工作日內通過可靠的運輸公司（例如 FedEx、SF、UPS 或 DHL）運送訂單。我們還支持其他運輸方式。如果您想詢問具體的運輸細節或費用，請隨時與我們聯繫。

關於付款

我們接受多種支付方式，包括VISA、MasterCard、銀聯、西聯、PayPal等渠道。

如果您有特定的付款方式或想詢問費率和其他詳細信息，請隨時與我們聯繫。

電匯

Paypal

信用卡

西聯匯款

速匯金

服務與包裝

About After Sales Service

All Parts Extended Quality Guarantee

自發貨之日起 90 天內發起申請。

與我們的工作人員確認退貨或換貨。

保持貨物收到時的原始狀態。

最後請注意，退貨或換貨的資格取決於對退貨商品實際狀況的評估。在完成退貨或換貨流程之前，我們將評估收到的貨物。如果您對退貨或換貨有任何疑問或需要進一步幫助，請隨時通過以下方式聯絡我們： [email protected]

關於包裝

在包裝方面，我們的產品均精心包裝在防靜電袋中，以提供ESD防靜電保護。外包裝堅固耐用且閉合牢固。我們支持各種包裝方法，例如捲帶式、切帶式、管式或託盤式。

例子

捲帶式

剪膠帶

管或託盤

H26M31001HPR 數據表

目前的價格方案正在編制中。請聯絡我們的客戶服務團隊獲取最新的價格資訊。感謝您的理解和支援!

快速報價

請提交詢價 H26M31001HPR 或發送電子郵件給我們： Email: [email protected], 我們將在 12 小時內與您聯繫。

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詳細說明

Introduction to H26M31001HPR

The H26M31001HPR is a NAND flash memory IC manufactured by SK Hynix. This IC offers high-density storage capacity and fast data transfer rates, making it suitable for use in a wide range of electronic devices requiring reliable and high-performance data storage. With its compact form factor and low power consumption, the H26M31001HPR is ideal for embedded systems, consumer electronics, and mobile devices.

Specs and Features

Memory Type: NAND flash memory with high-density storage capacity.
Data Transfer Rate: Provides fast data transfer rates for efficient read and write operations.
Form Factor: Compact size for easy integration into small form factor devices.
Operating Voltage: Supports low-power operation for energy-efficient performance.
Endurance: Offers high endurance for reliable long-term data storage and retrieval.
Package Type: Available in industry-standard packages for widespread compatibility.

Application and Uses

The H26M31001HPR is ideal for applications requiring high-density data storage:

Mobile Devices: Used in smartphones, tablets, and portable media players for storing apps, multimedia content, and user data.
Embedded Systems: Integrated into industrial control systems, medical devices, and IoT devices for reliable data storage.
Solid-State Drives (SSDs): Utilized in SSDs for high-speed data storage and retrieval in computing systems.
Smart TVs and Set-Top Boxes: Applied in smart TVs and streaming devices for storing firmware, apps, and cached content.

Equivalent Part

For similar functionalities, consider these alternatives to the H26M31001HPR:

MT29F2G08ABAEAWP: NAND flash memory IC with high density and fast data transfer rates for embedded applications.
TC58CVG0S3HRAI4: NAND flash memory IC designed for high-performance storage in consumer electronics and mobile devices.

規格

以下是所選零件的基本參數，涉及零件的特性及其所屬類別。

Rohs Code	Yes	Part Life Cycle Code	Obsolete
Ihs Manufacturer	SK HYNIX INC	Package Description	FBGA-153
Reach Compliance Code	compliant	ECCN Code	EAR99
HTS Code !	8542.32.00.51	JESD-30 Code	R-PBGA-B153
Memory Density	34359738368 bit	Memory IC Type	FLASH
Memory Width	8	Number of Functions	1
Number of Terminals	153	Number of Words	4294967296 words
Number of Words Code	4000000000	Operating Mode !	SYNCHRONOUS
Organization	4GX8	Package Body Material	PLASTIC/EPOXY
Package Code	BGA	Package Shape	RECTANGULAR
Package Style	GRID ARRAY	Peak Reflow Temperature (Cel)	NOT SPECIFIED
Programming Voltage !	3.3 V	Surface Mount !	YES
Technology	CMOS	Terminal Form !	BALL
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED